Laser-Formed Conductive Tracks in Molded Semiconductor Package
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Solution Overview
Problem
Conventional packaging solutions for semiconductor devices with densely arranged bond pads are ineffective and performance-limiting for providing unique electrical connections, as they struggle to efficiently connect terminals without increasing device size.
Innovation Solution
A semiconductor package with a laser activatable mold compound encapsulant body that forms conductive tracks and vertical interconnect structures, allowing for high-density electrical connections between semiconductor dies using laser patterning and plating processes, enabling efficient interconnects between bond pads and package leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging interconnect structures (bond wires, clips, ribbons) are used, then the device can be packaged, but the interconnect effectiveness and performance are limited for densely arranged bond pads
Solution Approach 1:
The patent replaces conventional mechanical interconnect structures (bond wires, clips, ribbons) with a laser-formed conductive track system embedded in the encapsulant. This substitution enables direct electrical connection from bond pads through the encapsulant material itself, eliminating the need for separate mechanical interconnect components and improving interconnect effectiveness for densely arranged bond pads.
Solution Approach 2:
The patent merges the encapsulant material with the interconnect function by forming conductive tracks directly within the encapsulant. This integration combines the protective encapsulation function with the electrical interconnection function, reducing overall device complexity while improving performance for dense bond pad arrangements.
2Volume of moving object
If the device size is reduced to accommodate densely arranged bond pads, then the functional capability increases, but the ability to provide unique electrical connections for each terminal becomes more challenging
Solution Approach 1:
The patent transitions from planar surface-level interconnects to three-dimensional conductive tracks embedded within the encapsulant volume. This dimensional transition allows electrical connections to route through the depth of the package, enabling unique electrical connections for each bond pad terminal even in compact devices with densely arranged pads.
Solution Approach 2:
The patent replaces conventional mechanical interconnect structures with laser-formed conductive tracks that can be precisely routed through the encapsulant material. This substitution enables efficient electrical connections in reduced device sizes by allowing direct, customized routing from each bond pad to its destination without requiring additional space for separate interconnect components.
3Productivity
If conventional interconnect structures are used, then the packaging can be completed, but the performance is limiting for densely arranged bond pads
Solution Approach 1:
The patent replaces conventional mechanical interconnect structures (bond wires, clips, ribbons) with laser-formed conductive tracks embedded in the encapsulant. This substitution dramatically improves interconnect efficiency for densely arranged bond pads by enabling direct electrical routing through the encapsulant material, eliminating the need for complex mechanical interconnect assemblies.
Solution Approach 2:
The patent extracts the interconnect function from separate mechanical components and integrates it directly into the encapsulant material through laser-formed conductive tracks. This extraction and integration approach simplifies the overall package structure while improving interconnect efficiency, as the encapsulant simultaneously provides both protection and electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high-density interconnect capability, allowing for efficient electrical connections between semiconductor dies and package leads, enhancing the interconnect requirements of modern semiconductor devices while maintaining a compact design.
Implementation Method 1
a first conductive track that is formed in the upper surface of the encapsulant body... The encapsulant body includes a laser activatable mold compound... The first conductive track is formed in a first laser activated region of the laser activatable mold compound
Data Source
AI summary
A semiconductor package includes an electrically insulating first encapsulant body having an upper surface, a first semiconductor die encapsulated within the first encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the first encapsulant body, a plurality of electrically conductive leads, each of the leads having interior ends that are encapsulated within the first encapsulant body and outer ends that are exposed from the first encapsulant body, and a first direct electrical connection between the first conductive pad and the interior end of a first lead from the plurality. The first direct electrical connection includes a first conductive track formed in the upper surface of the first encapsulant body. The first encapsulant body includes a laser activatable mold compound. The first conductive track is formed in a first laser activated region of the laser activatable mold compound.