Laser Connection Structure Dual-Surface Substrate Impedance
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Solution Overview
Problem
Existing laser transmitter packaging technologies face challenges in miniaturization due to the need for increased ceramic substrate volume when pins are densely packed on one side, and the existing manufacturing processes cannot achieve simultaneous wire bonding on opposite surfaces of a ceramic substrate, leading to impedance matching issues with high-frequency signals.
Innovation Solution
A connection structure for a laser that uses a first insulation substrate with conductive paths on both surfaces, where a second insulation substrate with a conductive path on its upper surface is connected via a through-hole to the lower surface of the first substrate, allowing for simultaneous wire bonding and avoiding the need for conductive path abutting, thus enabling direct transmission of high-frequency signals without impedance mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If pins are disposed at the same side surface of a ceramic substrate, then the laser transmitter can be miniaturized, but the volume of the ceramic substrate increases
Solution Approach 1:
The patent transitions from a two-dimensional arrangement where all pins are located on one surface of the ceramic substrate to a three-dimensional arrangement where pins are distributed on both the upper and lower surfaces. This dimensional change allows for more efficient space utilization, reducing the overall substrate area required while maintaining the same number of pin connections, thereby enabling laser transmitter miniaturization.
2Area of stationary object
If pins are welded to opposite surfaces of a ceramic substrate, then the ceramic substrate volume is reduced, but the manufacturing process cannot achieve simultaneous wire bonding on both surfaces
Solution Approach 1:
The patent divides the wire bonding process into two separate sequential operations: first bonding wires to pins on the upper surface, then bonding wires to pins on the lower surface. This segmentation of the manufacturing process allows each bonding operation to be performed independently on one surface at a time, avoiding the technical limitation of simultaneous bidirectional bonding while maintaining the compact dual-surface pin arrangement.
3Ease of manufacture
If conductive paths are abutted to transfer connections, then wire bonding can be achieved on one surface, but impedance matching for high-frequency signals deteriorates
Solution Approach 1:
The patent introduces a conductive layer as an intermediary element that bridges the gap between the abutted conductive paths. This conductive layer, positioned at the interface where conductive paths from opposite surfaces meet, ensures continuous electrical connection and maintains proper impedance characteristics for high-frequency signals, thereby resolving the impedance matching issues caused by direct path abutment.
Data Source
AI summary
A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.