Laser-Separable Contact Package for Precise Parallel Placement
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Solution Overview
Problem
The handling and production of electronic components in microtechnology are cumbersome due to the small structures involved, requiring high precision for contact placement to avoid short-circuits and ensure functionality, which is time-intensive and often results in a large number of reject parts.
Innovation Solution
A package comprising at least two contacts for microtechnology, where the contacts are connected to a support structure made of a separable and/or destructible material, such as a metal alloy, that can be precisely positioned and oriented in a single plane, allowing simultaneous placement and connection of multiple contacts using a laser for separation and destruction of the support structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If contacts are placed individually with high precision to avoid short-circuits, then placement accuracy is improved, but production time increases and productivity decreases
Solution Approach 1:
The support structure is segmented into a first support structure and a second support structure, which are separable by a laser. This allows multiple contacts to be held and positioned simultaneously as one unit, enabling parallel placement, while still allowing individual contact separation when needed. The segmentation resolves the contradiction by enabling both high-speed parallel handling and precise individual placement.
Solution Approach 2:
Multiple contacts are pre-positioned on the support structure at their final target locations before placement onto the electronic component. The support structure preliminarily holds all contacts in their correct positions, ensuring precision is already established before the placement operation begins. This preliminary positioning enables simultaneous placement of multiple contacts with high precision, improving productivity without sacrificing accuracy.
2Productivity
If multiple contacts are placed simultaneously to save time, then productivity is improved, but placement precision may deteriorate
Solution Approach 1:
Multiple contacts are merged into a single handling unit by attaching them to the support structure. This allows simultaneous placement of multiple contacts as one group, improving productivity. The support structure maintains the relative positions and orientations of all contacts, ensuring that precision is preserved during the simultaneous placement operation. The merging enables parallel processing without sacrificing individual contact accuracy.
3Manufacturing precision
If the support structure is made separable by laser for precise removal, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The mechanical separation of the support structure is replaced by laser separation. Instead of designing complex mechanical release mechanisms, the support structure is made separable by laser, which provides precise and clean separation without mechanical complexity. The laser separation method substitutes a simple material property (laser separability) for a complex mechanical separation system, resolving the contradiction between precision and device complexity.
4Manufacturing precision
If individual contact placement is performed to ensure precision, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The support structure enables continuous handling and placement of multiple contacts in a single operation. Instead of performing discrete placement operations for each contact, the support structure allows all contacts to be placed continuously in one action, eliminating the time loss associated with repeated individual placement operations. The continuity of the placement action maintains precision while dramatically reducing total placement time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and simultaneous placement of multiple contacts, significantly reducing time and labor while maintaining high precision, thereby minimizing reject parts and ensuring the functionality of electronic components.
Implementation Method 1
A laser beam is characterized by its coherent light and its high intensity, thus making it possible to yield an energy input in a selective and targeted manner with high precision
Implementation Method 2
separation and/or destruction of the support structure, said support structure being separable and/or destructible by means of a laser, are enabled by means of the laser
Data Source
AI summary
A package comprises at least two contacts for microtechnology, the contacts each having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from each other and disposed in such a manner that the contact surfaces are disposed in one plane and are oriented in the same direction. The support structure is made of a connective material being separable and/or destroyable by a laser. Furthermore, a method for handling such a package and a tool for implementing such a method are provided.