Laser Contacting Device for Electronic Components
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Solution Overview
Problem
Conventional 'flip-chip' technology is limited to thin electronic components due to thermal resistance and poor heat conductance, making it inefficient for larger components with poor heat conductive materials, such as capacitors with dielectric materials.
Innovation Solution
A method and device that apply laser energy directly to the terminal faces of electronic components during positioning and removal, using vacuum assistance to facilitate solder melting and independent of the component's heat conductance characteristics, allowing for rapid heating and efficient contacting regardless of material properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If indirect laser energy application through the component body is used, then the component can be heated, but the heating time becomes excessively long due to thermal resistance and poor heat conductance
Solution Approach 1:
The patent extracts the laser heating process from the component body and applies it directly to the terminal faces. By removing the intermediate step of heating through the bulk material, the process eliminates the thermal resistance barrier and achieves rapid heating of the terminal faces for contacting, directly resolving the time loss issue.
Solution Approach 2:
The patent introduces a solder material as an intermediary between the terminal faces. The solder material absorbs laser energy efficiently and melts rapidly, facilitating the contacting process without requiring prolonged heating of the component body itself, thus reducing overall contacting time.
2Adaptability or versatility
If flip-chip technology is used for thin components, then contacting can be achieved, but the method is not suitable for larger components with poor heat conductance materials
Solution Approach 1:
The patent applies local quality by concentrating laser energy specifically at the terminal faces rather than heating the entire component body. This localized heating approach works effectively regardless of the component's overall size or bulk material heat conductance properties, enabling versatile application across different component types while maintaining reliable contacting.
Solution Approach 2:
The patent changes the heating parameters by switching from bulk body heating to surface-level terminal face heating. This parameter change allows the process to accommodate components with varying sizes and material properties, including those with poor heat conductance, thereby improving adaptability without compromising contacting reliability.
3Productivity
If laser energy is applied directly to terminal faces during positioning, then contacting time is reduced, but the component requires precise positioning and holding
Solution Approach 1:
The application device is designed with multi-functionality, combining vacuum holding capability with laser energy application and positioning functions in a single integrated system. This universal device handles the component through multiple process stages without requiring separate complex systems, thereby achieving rapid contacting while managing positioning and holding requirements efficiently.
Solution Approach 2:
The patent replaces complex mechanical positioning and holding mechanisms with a vacuum-based holding system. The vacuum field provides secure component retention during laser heating and positioning without requiring intricate mechanical clamps or fixtures, thus improving productivity while controlling device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and rapid contacting of larger electronic components with poor heat conductance materials by applying laser energy during positioning and removal, reducing contacting time and overcoming thermal resistance limitations.
Implementation Method 1
directly applying laser energy to the component terminal faces
Implementation Method 2
applying laser energy to the metallic capacitor plates separated by the dielectric
Implementation Method 3
evaporation components parts, which are released during the heating of the component terminal faces
Implementation Method 4
a vacuum is applied to the component during the removal and the positioning of the component
Implementation Method 5
melting of a solder material, which is built up on the component terminal faces and/or on the substrate terminal faces
Implementation Method 6
applying laser energy to the component terminal faces so as to ensure a heat conduction
Data Source
AI summary
The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently positions the component on the substrate in such a manner that the component terminal faces which extend from a contact side of the component up to a component rear side and the substrate terminal faces are in an overlapping position. A direct application of laser energy subsequently contacts the terminal faces to the component terminal faces. The application device has a contact nozzle with a component accommodating area for accommodating the component. The contact nozzle has a vacuum opening coupled to a vacuum duct and an emission opening for applying laser radiation to the component. The emission opening includes two emission windows which are spaced apart from one another by a component contact surface and each of the two emission windows is assigned to one of the terminal faces of the component. The component contact surface is formed by two front surfaces of two support bars which are arranged so as to be located opposite one another and which are embodied in the vacuum duct.