Methods for laser forming transparent articles from a transparent mother sheet and processing the transparent articles in-situ
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Solution Overview
Problem
Current methods for cutting and processing glass substrates are inefficient, lacking speed, cleanliness, cost-effectiveness, and reliability, particularly in the production of thin film transistors and display materials for electronic devices.
Innovation Solution
A method involving laser processing of transparent mother sheets to form closed contours with defects, allowing for the separation of transparent articles with minimal kerf, enabling in-situ processing and collective surface modification before release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cutting methods are used to separate glass substrates, then separation can be achieved, but the process is slow and produces excessive waste material
Solution Approach 1:
The patent replaces traditional mechanical cutting methods with laser-based processing. The laser forms closed contours of defects within the glass substrate, enabling separation through stress application rather than mechanical removal. This substitution dramatically increases processing speed and reduces waste material, as the laser method creates minimal kerf and allows for precise separation along desired paths.
Solution Approach 2:
The patent utilizes laser parameters (wavelength, pulse duration, energy density) to induce controlled defects in the glass substrate. By adjusting these parameters, the process achieves clean separation with minimal material removal. The laser wavelength is selected to match absorption characteristics of the glass, enabling precise energy deposition and defect formation without excessive heating or material loss.
2Productivity
If glass substrates are processed individually, then each article can be treated precisely, but the overall processing time and cost increase
Solution Approach 1:
The patent merges multiple glass substrates into a mother sheet configuration, allowing simultaneous processing of multiple articles. The laser forms closed contours across the entire mother sheet, and stress is applied uniformly to separate all articles in one operation. This combining approach maintains precision because each article retains its defined geometry and the laser processing can be controlled to account for variations across the sheet.
Solution Approach 2:
The patent performs preliminary laser processing to form closed contours of defects across the entire mother sheet before separation. This preliminary action prepares all articles for simultaneous stress-induced separation, ensuring that each article is properly prepared for clean breakage along the desired contours. The preliminary defect formation ensures that subsequent separation maintains high precision for all articles.
3Reliability
If conventional processing methods are used, then existing equipment can be utilized, but the process lacks cleanliness and reliability
Solution Approach 1:
The patent replaces mechanical cutting and handling processes with laser-based defect formation and stress-induced separation. This substitution eliminates mechanical contact that could generate contamination or damage the glass surfaces. The laser method creates clean defect patterns without generating particulate waste, and the stress separation process produces clean breaks without the contamination associated with mechanical sawing or breaking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates faster, cleaner, and more reliable processing of glass substrates, allowing for efficient separation and surface modification of transparent articles while remaining engaged with the mother sheet, addressing the limitations of existing techniques.
Implementation Method 1
the portion of the pulsed laser beam directed into the transparent mother sheet generates an induced absorption within the transparent mother sheet and induces a defect within the transparent mother sheet
Implementation Method 2
heating the transparent mother sheet with an infrared laser beam along the closed contour line to a temperature at which the transparent mother sheet spontaneously breaks apart along the closed contour
Data Source
Figure 1A
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Figure 2
AI summary
A method for processing a transparent mother sheet includes forming one or more closed contours in the transparent mother sheet that each define a perimeter of a transparent article. Forming each of the one or more closed contours includes directing a pulsed laser beam into the transparent mother sheet to produce defect within the transparent mother sheet and translating the transparent mother sheet and the pulsed laser beam relative to each other thereby laser forming defects along the one or more closed contours. The method further includes separating a portion of the transparent mother sheet along the closed contours, thereby forming one or more transparent articles, where the transparent articles are frictionally engaged with a frame portion of the transparent mother sheet, applying material to a surface the transparent articles, and releasing the transparent articles from frictional engagement with the frame portion.