Laser Irradiation Apparatus Conveying Unit Positioning

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Solution Overview

Problem

Substrates are unevenly irradiated with laser beams due to deflection caused by stress from conveying units, leading to issues with depth of focus during laser annealing processes in existing laser irradiation apparatuses.

Innovation Solution

A laser irradiation apparatus design where the conveying unit holds the workpiece at a position that does not overlap the laser irradiation position, reducing stress-induced deflection and maintaining the substrate within the depth of focus of the laser beam.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the conveying unit holds the substrate during conveyance through the laser irradiation position, then the substrate can be conveyed and irradiated with the laser beam, but stress is propagated to the substrate causing deflection and uneven irradiation

Engineering Contradiction:
Improvesubstrate conveyance and irradiation efficiencyVSAvoidirradiation uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent extracts the conveying unit from the laser irradiation position area. The conveying unit is configured to convey the substrate through a path that does not overlap with the laser beam irradiation position, thereby removing the source of stress-induced deflection from the critical irradiation zone while maintaining substrate conveyance functionality

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a flotation unit as an intermediary mechanism between the conveying unit and the substrate. The substrate is floated on a gas film during conveyance and irradiation, which isolates the substrate from direct mechanical contact with the conveying unit, eliminating stress propagation while maintaining positional control

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11355343B2Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
Publication Date: 2022.06.07 JSW AKTINA SYST CO LTD
  • US11355343B2 patent drawing
  • US11355343B2 patent drawing
  • US11355343B2 patent drawing

AI summary

A laser irradiation apparatus (1) according to one embodiment includes a laser generating device (14) that generates a laser beam, a flotation unit (10) that causes a workpiece (16) that is to be irradiated with the laser beam to float, and a conveying unit (11) that conveys the floating workpiece (16). The conveying unit (11) conveys the workpiece (16) with the conveying unit (11) holding the workpiece (16) at a position where the conveying unit (11) does not overlap an irradiation position (15) of the laser beam. The laser irradiation apparatus (1) according to one embodiment makes it possible to suppress uneven irradiation with a laser beam.