Semiconductor Laser Cooling Block Layout for Insulation and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor laser devices with cooling water flow paths suffer from reduced heat dissipation efficiency due to the use of insulating materials, which limits the increase in output and leads to performance degradation and potential failure.
Innovation Solution
A semiconductor laser device with a heat dissipation block featuring a flow path for coolant, where the upper heat dissipation block is made of conductive material and directly cooled, enhancing heat discharge efficiency and allowing higher current flow without the need for additional conductive members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating material is provided between the heat sink and semiconductor laser element for electrical insulation, then electrical insulation is achieved, but heat dissipation efficiency deteriorates due to low thermal conductivity
Solution Approach 1:
The heat dissipation block is divided into multiple blocks (first heat dissipation block, second heat dissipation block, third heat dissipation block) with insulating sealant layers between them. This segmentation allows electrical insulation at specific interfaces while maintaining thermal conduction paths through the conductive material blocks themselves, resolving the contradiction between insulation and heat dissipation.
Solution Approach 2:
Different regions of the heat dissipation structure have different material properties: the insulating sealant provides electrical insulation where needed, while the conductive material blocks provide thermal conduction. This local differentiation of material properties allows simultaneous achievement of electrical insulation and efficient heat dissipation.
2Power
If higher current is flowing into the semiconductor laser element to increase output, then output increases, but temperature rises due to Joule heat causing performance degradation
Solution Approach 1:
The heat dissipation block acts as an intermediary thermal management system between the semiconductor laser element and the cooling water. It provides a dedicated thermal conduction path that efficiently transfers heat away from the element, enabling higher current operation without temperature-induced performance degradation.
Solution Approach 2:
Cooling water flows through the heat dissipation block to actively remove heat generated by the semiconductor laser element. This hydraulic cooling system enables sustained high-power operation by continuously extracting Joule heat, preventing temperature rise that would otherwise cause performance degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency, enabling higher output and reducing the size and cost of power supply equipment while maintaining effective insulation and heat dissipation.
Implementation Method 1
The upper heat dissipation block made of a conductive material disposed in contact with an upper surface of the insulating sealant, covering the opening... enables the upper heat dissipation block located above the opening of the insulating sealant to be directly cooled by the coolant
Implementation Method 2
increase in output of a semiconductor laser device increases the amount of current flowing into a semiconductor laser element, so that temperature of the semiconductor laser element rises due to Joule heat
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Provided is semiconductor laser device 100 including heat dissipation block 60 provided with flow path 66 of a coolant, and first and second semiconductor laser modules 10, 20. Heat dissipation block 60 include lower heat dissipation block 61 formed with groove 65, insulating sealant 62 that has openings 62a, 62b above groove 65 and is disposed on lower heat dissipation block 61, and first and second upper heat dissipation blocks 63a, 63b covering openings 62a, 62b, respectively. First semiconductor laser module 10 is disposed in contact with an upper surface of first upper heat dissipation block 63a, having a positive electrode side facing down, and second semiconductor laser module 20 is disposed in contact with an upper surface of second upper heat dissipation block 63b, having a negative electrode side facing down.