Laser Cooling Module Radiating Fin Structure
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Solution Overview
Problem
Current liquid-cooled semiconductor lasers face issues with high production costs, difficulty in processing, short lifetime, high maintenance costs, and stringent sealing requirements due to their micro-channel structure, which limits their heat dissipation efficiency and reliability.
Innovation Solution
A novel cooling module with a radiating fin structure replaces the micro-channel design, using a liquid cooling plate made of metal, ceramic, or composite materials with enlarged water passages and radiating fins for enhanced heat dissipation, simplifying fabrication and reducing pressure drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If micro-channel liquid cooling structure is used, then heat dissipation capability is enhanced and power output is increased, but production cost increases and processing difficulty increases
Solution Approach 1:
The patent changes the geometric parameters of the cooling structure from micro-scale channels to macro-scale water passages with enlarged cross-sections. This parameter change simplifies the processing difficulty while maintaining effective heat dissipation capability, thereby reducing production costs without sacrificing power output capability
Solution Approach 2:
The patent segments the cooling function into two distinct components: enlarged water passages for bulk cooling and radiating fins for surface heat dissipation. This segmentation allows each component to be optimized independently, simplifying manufacturing while achieving effective heat removal to support high power output
2Temperature
If micro-channel liquid cooling structure is used, then heat dissipation capability is enhanced, but device complexity increases and sealing requirements become more stringent
Solution Approach 1:
The patent divides the heat dissipation system into separate functional elements: enlarged water passages for liquid cooling and radiating fins for thermal radiation. This segmentation simplifies the overall structure by eliminating the complex micro-channel network while maintaining heat dissipation effectiveness through coordinated action of both components
Solution Approach 2:
The radiating fins act as an intermediary between the water passages and the surrounding environment, facilitating heat transfer from the cooling liquid to ambient air. This intermediary structure simplifies the sealing requirements compared to micro-channels while enhancing heat dissipation efficiency through combined convection and radiation
3Power
If micro-channel liquid cooling structure is used, then heat dissipation capability is enhanced, but lifetime is reduced and reliability decreases
Solution Approach 1:
The patent changes the dimensional parameters of the cooling passages from micro-scale to macro-scale, eliminating the vulnerability of micro-channels to clogging and impurity accumulation. This parameter change significantly improves reliability and extends the operational lifetime of the laser system while maintaining effective heat dissipation capability
4Temperature
If micro-channel liquid cooling structure is used, then heat dissipation capability is enhanced, but pressure drop of cooling liquid increases
Solution Approach 1:
The patent changes the cross-sectional area parameter of the cooling passages by enlarging them from micro-scale to macro-scale dimensions. This parameter change reduces flow resistance and pressure drop of the cooling liquid while maintaining sufficient heat dissipation capability through the combination of enlarged passages and radiating fins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces production costs, enhances heat dissipation efficiency, increases the reliability of the semiconductor laser, and allows for higher power output while maintaining beam quality, with easier maintenance and less stringent sealing requirements.
Implementation Method 1
a radiating fin (6) is provided within the liquid inlet (4-2) of the liquid cooling plate (2)
Implementation Method 2
a radiating fin (6) is provided within the liquid inlet (4-2) of the liquid cooling plate (2)
Implementation Method 3
with the heat sink (7) attaching to a positive electrode surface of the chip (8)
Data Source
AI summary
This invention relates to semiconductor lasers, and more particularly, to a cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the present invention effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively elongates the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.