Compact Laser Device Cooling Plate Design
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Solution Overview
Problem
Conventional laser devices with compact housings face challenges in efficiently cooling heat-generating parts due to reduced space, making it difficult to effectively utilize water-cooling plates for heat dissipation.
Innovation Solution
The laser device is designed with a water-cooling plate having opposing cooling surfaces, where heat-generating units like the LD module and power supply are arranged adjacent to one surface, and the cavity is arranged adjacent to the other, with intermediate heat-conducting members to enhance cooling efficiency while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing is made compact to reduce size, then the device size is reduced, but the space for installing cooling components is reduced, making it difficult to cool heat-generating parts efficiently
Solution Approach 1:
The water-cooling plate is integrated into the housing structure itself, merging the cooling function with the structural component. This eliminates the need for separate cooling chambers and allows efficient cooling of heat-generating parts within the compact housing volume.
Solution Approach 2:
The water-cooling plate utilizes the thickness dimension of the housing by extending cooling surfaces in the thickness direction. This three-dimensional cooling approach maximizes the cooling surface area within the limited compact volume, allowing efficient heat dissipation without increasing the device's external dimensions.
2Volume of moving object
If the housing is made compact, then the device size is reduced, but the distance between parts is reduced, making it difficult to install and maintain components
Solution Approach 1:
The housing is divided into multiple accessible sections with openings that allow individual components or assemblies to be accessed, removed, or replaced. This segmentation maintains compact overall dimensions while providing sufficient access space for maintenance operations on specific components.
3Temperature
If water-cooling plates are used for cooling, then cooling effectiveness is improved, but the device complexity and space requirements increase
Solution Approach 1:
The water-cooling plate is merged with the housing structure, combining thermal management functionality with the mechanical support structure. This integration eliminates the need for separate cooling chambers and reduces the number of discrete components, thereby simplifying the overall system while maintaining effective cooling.
Solution Approach 2:
The water-cooling plate serves multiple functions simultaneously: it provides structural support as part of the housing, acts as a thermal management component for cooling heat-generating parts, and potentially serves as a mounting surface for other components. This multi-functionality reduces the need for additional dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more efficient cooling of heat-generating parts, achieving a compact size without compromising cooling effectiveness, and simplifies the design and maintenance of the laser device.
Implementation Method 1
a water-cooling plate with a water-cooling pipe embedded in the water-cooling plate
Implementation Method 2
these heat-generating parts are cooled by using a water-cooling plate with a water-cooling pipe embedded in the water-cooling plate
Data Source
AI summary
A laser device includes a light-emitting unit that generates a laser beam, an amplification unit that amplifies the laser beam generated by the light-emitting unit, a power supply unit that supplies power for generating the laser beam to the light-emitting unit, a plate-like cooling unit including a first cooling surface and a second cooling surface positioned opposite to the first cooling surface, and a housing in which the light-emitting unit, the amplification unit, the power supply unit, and the cooling unit are housed. The power supply unit and the light-emitting unit are arranged adjacent to the first cooling surface of the cooling unit. The amplification unit is arranged adjacent to the second cooling surface of the cooling unit.