Laser Processing of Curved Workpiece Surfaces With Synchronized Orientation
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Solution Overview
Problem
Existing laser processing methods for hard and brittle materials like metals and ceramics face challenges in achieving high surface quality, require redundant components, and result in increased complexity, cost, and susceptibility to errors when processing curved surfaces.
Innovation Solution
A method and device that synchronizes the orientation of the workpiece with respect to a reference path and the movement of the laser beam along a defined path, eliminating the need for redundant components by simultaneously controlling optical and mechanical axes, and optimizing energy distribution and processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the workpiece is oriented into a fixed position and the laser beam is scanned along the surface, then the processing can be performed with simple device structure, but the incidence angle of the laser beam fluctuates depending on the curvature of the surface, changing processing properties such as processing rate and surface roughness
Solution Approach 1:
The patent applies dynamics by making the workpiece orientation dynamic rather than fixed. The holder continuously orients the workpiece during laser processing to maintain a constant incidence angle between the laser beam and the processing surface, even as the laser beam scans across curved surfaces. This dynamic adjustment resolves the contradiction by allowing simple device structure while maintaining consistent processing conditions and surface quality.
2Manufacturing precision
If the optical axes and mechanical axes are made redundant to maintain constant incidence angle, then the processing precision is improved, but the device complexity increases, introducing additional susceptibility to errors, maintenance effort, and cost
Solution Approach 1:
The patent applies universality by making the mechanical axes serve dual functions: they both position the workpiece and continuously orient it to maintain constant incidence angle. This eliminates the need for separate redundant optical axes, as the mechanical positioning system is made multi-functional. The result is improved incidence angle consistency without increasing device complexity or adding susceptibility to errors.
3Productivity
If the laser beam movement velocity is increased to reduce processing time, then the productivity is improved, but the energy distribution becomes non-uniform and processing quality deteriorates
Solution Approach 1:
The patent applies feedback by continuously monitoring the relative position between the laser beam and the workpiece surface, and using this information to dynamically adjust either the laser beam velocity or the workpiece orientation speed. This feedback control ensures uniform energy distribution across the processing surface even at high processing speeds, resolving the contradiction between productivity and processing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes processing time and energy input, reduces investment and operational costs, and enhances surface quality by ensuring homogeneous energy distribution and consistent processing characteristics.
Implementation Method 1
The impingement of the laser beam onto that surface locally melts, vaporizes and/or ablates material from the workpiece
Implementation Method 2
The impingement of the laser beam onto that surface locally melts, vaporizes and/or ablates material from the workpiece
Data Source
Figure 1
Figure 2
Figure 3A~3C
AI summary
The present invention relates to a laser processing method (100) and device (200), in particular for processing a processing surface (5) of any shape of a workpiece (2), preferably a curved surface of a cutting tool, wherein through simultaneous orientation of a workpiece (2) and movement of a laser beam (205) across a processing surface (5) of the workpiece (2) a processing volume (4) is removed from the workpiece (2) to expose a final surface (3).