Integrated Laser-Cutter Head for Accurate Tabletop Machining
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional laser and cutter machining systems require separate operation of laser and cutter processing machines, leading to reduced machining accuracy and increased complexity in handling complex workpieces.
Innovation Solution
A laser and cutter machining apparatus that integrates a laser and cutter mechanism within a single device, allowing for simultaneous movement along guide rails, thereby improving machining accuracy and simplifying operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate laser and cutter processing machines are used, then operational flexibility is maintained, but machining accuracy deteriorates due to separate operations and repositioning
Solution Approach 1:
The patent combines the laser processing mechanism and cutter processing mechanism into a single integrated device that shares common components including the guide rail, moving platform, and control system. This merging eliminates the need for separate machines while maintaining the functional capabilities of both laser and cutter processing, thereby improving machining accuracy through unified positioning without proportionally increasing overall system complexity.
Solution Approach 2:
The moving platform is designed to accommodate both laser and cutter processing mechanisms, enabling a single device to perform multiple processing functions. The platform can selectively position either the laser or cutter mechanism over the workpiece, providing universal functionality that replaces multiple specialized machines while maintaining operational flexibility.
2Productivity
If separate laser and cutter machines are operated independently, then each machine can be optimized for its specific function, but operational complexity increases and machining efficiency decreases
Solution Approach 1:
The integrated device merges the operational controls of laser and cutter machines into a single unified control system. The control module can selectively activate either the laser or cutter mechanism based on processing requirements, eliminating the need for separate machine operations and reducing overall operational complexity while improving machining efficiency through continuous processing capability.
3Manufacturing precision
If repositioning is required between laser and cutter machines, then different processing operations can be performed, but machining accuracy deteriorates due to cumulative positioning errors
Solution Approach 1:
The moving platform provides a universal positioning system that can accurately position both laser and cutter mechanisms over the same workpiece coordinates. This multi-functional platform eliminates the need for repositioning between separate machines, maintaining positioning accuracy while enabling both laser and cutter processing operations on the same workpiece through coordinated movement of the shared platform.
Data Source
AI summary
A laser and cutting machining apparatus includes a laser cutting device, and the laser cutting device includes a housing, a guide plain shaft, and a machining mechanism. The guide plain shaft is arranged in the housing, and the machining mechanism includes a laser shell slidably connected to the guide plain shaft, a laser device arranged in the laser shell, and a cutter mechanism arranged in the laser shell; the laser device and the cutter mechanism is movable with the laser shell along the guide plain shaft relative to the housing. The laser and cutting machining apparatus integrates the laser device and the cutter mechanism, is simple and convenient to operate, and can perform laser engraving and cutter cutting on a workpiece by a laser or a cutter, thereby achieving the tabletop and miniaturized configuration of the laser and cutting machining apparatus.