Laser Cutting Ceramic Electronic Components
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Solution Overview
Problem
Current methods for cutting ceramic electronic components, such as those using blades, often result in deformation, shear stress-induced cracks, chip attachment defects, and reduced capacitance due to reference marks during laser cutting.
Innovation Solution
A method involving the formation of a ceramic laminate with internal electrode patterns, obtaining an image of its upper portion, setting cutting regions based on the image, and cutting using a laser to prevent deformation and shear stress, eliminating the need for reference marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a blade cutting method is used to cut the ceramic laminate, then the cutting process is simple and direct, but shear stress is applied to the ceramic laminate causing cracks and deformation
Solution Approach 1:
The patent replaces the mechanical blade cutting system with a laser cutting system. The laser beam irradiates the ceramic laminate to perform cutting without mechanical contact, thereby eliminating shear stress and preventing cracks and deformation while maintaining cutting effectiveness
2Manufacturing precision
If reference marks are inserted into the ceramic laminate to set cutting lines for laser cutting, then cutting precision is improved, but capacitance of the final product decreases
Solution Approach 1:
The patent uses optical imaging to create a virtual copy of the ceramic laminate surface, capturing the positions of internal electrode patterns. This optical copy is then processed to determine cutting lines without requiring physical reference marks, thereby maintaining capacitance while achieving precise cutting
Solution Approach 2:
The patent introduces an image processing system as an intermediary between the ceramic laminate and the laser cutting process. The system captures images of the laminate, processes them to identify internal electrode patterns, and determines cutting lines based on these patterns, eliminating the need for reference marks that would reduce capacitance
3Productivity
If the ceramic laminate is compressed to form a laminate structure, then the multilayer structure is formed, but deformation occurs making straight line cutting difficult
Solution Approach 1:
The patent transitions from a static straight line cutting approach to a dynamic cutting path that adapts to the actual laminate shape. The system captures the deformed laminate shape through imaging, processes the image to determine appropriate cutting lines that follow the laminate's contours, and executes cutting along these adaptive paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents cutting defects, cracks, and capacitance loss by allowing non-contact, curved cuts that account for laminate deformation, reducing chip attachment issues and maintaining component performance.
Implementation Method 1
cutting the ceramic laminate by irradiating the cutting regions with a laser
Implementation Method 2
cutting the ceramic laminate by irradiating the cutting regions with a laser
Data Source
AI summary
A method for manufacturing a ceramic electronic component includes: forming a ceramic laminate by stacking ceramic green sheets on which internal electrode patterns are formed; obtaining an image of an upper portion of the ceramic laminate; determining cutting regions based on the image; and cutting the ceramic laminate by irradiating the cutting regions with a laser.