Laser Cutting Paths for Clean Sheet Metal Hole Formation

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Solution Overview

Problem

Existing laser processing methods for forming holes in sheet metal often result in poor processing quality due to the formation of numerous dividing marks on the cut surface, which can interfere with the operation of the processing head and cause defects.

Innovation Solution

The proposed solution involves a laser processing method, machine, and processing program creation device that minimizes dividing marks on the cut surface by strategically arranging cutting paths and dividing lines to form holes with good processing quality, particularly for elongated, rectangular, round, and square holes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the hole formation area is divided into a plurality of small scraps to prevent scrap from rising and interfering with the processing head, then the reliability of the processing is improved, but the manufacturing precision deteriorates due to the formation of many dividing marks on the cut surface

Engineering Contradiction:
Improveprocessing reliabilityVSAvoidcut surface quality
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the hole formation area into multiple small scraps through strategically placed dividing lines. This segmentation prevents large scraps from rising and interfering with the processing head, thereby improving processing reliability while controlling the number of dividing marks through optimized line placement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by making the dividing lines connect to specific boundaries (opposite boundary or adjacent boundaries) rather than uniformly distributing divisions throughout the area. This localized approach to division placement reduces the total number of dividing marks on the cut surface while still achieving the goal of preventing scrap interference.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the cutting path is extended to cover the entire hole formation area to ensure complete hole formation, then the manufacturing precision is improved, but the device complexity increases due to multiple dividing lines and cutting paths

Engineering Contradiction:
Improvehole formation accuracyVSAvoidcutting path complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the cutting path into multiple segments connected by dividing lines that extend from one boundary to another. This segmentation allows the cutting path to cover the entire hole formation area for complete hole formation while organizing the complexity through structured connection rules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The dividing lines serve multiple functions: they divide the hole formation area into manageable scraps, connect cutting path segments, and extend to boundaries to ensure complete coverage. This multi-functionality reduces device complexity by using the same structural element for multiple purposes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If the laser processing machine cuts around the hole formation area and then cuts around the part to form a hole, then the ease of operation is improved, but the productivity decreases due to the sequential two-step cutting process

Engineering Contradiction:
Improveprocessing simplicityVSAvoidhole formation efficiency
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent applies preliminary action by pre-defining dividing lines that connect opposite boundaries or adjacent boundaries before the cutting process begins. This preliminary structuring of the cutting path allows the laser processing machine to execute the cutting in a more efficient single-pass operation while maintaining operational simplicity through the pre-planned path.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the number of dividing marks on the cut surface, improving processing quality and preventing interference with the processing head, thereby enhancing the operational efficiency and accuracy of the laser processing machine.

Implementation Method 1

A laser processing machine irradiates, with a laser beam, a sheet metal mounted on a table, on which a plurality of skids are arranged, to cut the sheet metal

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP4249162B1Laser processing method, laser processing machine, and processing program creation device
Publication Date: 2025.05.28 AMADA CO LTD
  • EP4249162B1 patent drawingFigure 1
  • EP4249162B1 patent drawingFigure 2
  • EP4249162B1 patent drawingFigure 3A(a)~3A(d)

AI summary

A first cutting line (CL1) is formed in a sheet metal by continuously cutting a first cutting path (a). A second cutting line (CL2) is formed in the sheet metal by continuously cutting a second cutting path (b). The sheet metal is cut along a plurality of third cutting paths with a plurality of positions on the first cutting line (CL1) as cutting start points and intermediate positions between the first cutting line (CL1) and the second cutting line (CL2) as cutting end points to form a plurality of first dividing lines (DL3 to DL8) (c). The sheet metal is cut along a plurality of fourth cutting paths with a plurality of positions on the second cutting line (CL2) as cutting start points and the intermediate positions as cutting end points to form a plurality of second dividing lines (DL9 to DL14) (d).