Laser-Finished Cutting Edge Region for Feed-Mark-Free Tools
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Solution Overview
Problem
Cutting tools made from materials like PCD, SCD, and BLCBN face challenges during manufacturing, such as prolonged processing times and edge chipping due to shallow laser beam focus, which results in rounded edges and feed marks, compromising linearity and surface roughness.
Innovation Solution
A method using a laser with a depth of focus equal to or deeper than the cutting edge region width, combined with an interference laser beam and a condensing optical system, to process the cutting edge region without feed marks and improve linearity, ensuring a surface roughness of 0.2 µm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional laser beam with shallow depth of focus is used to process the cutting edge region, then the processing time is reduced compared to grinding, but the edge becomes rounded and feed marks appear, deteriorating linearity and surface roughness
Solution Approach 1:
The patent changes the depth of focus parameter of the laser beam from shallow (conventional) to deep (equal to or deeper than the cutting edge region width). This parameter change allows the laser to process the entire cutting edge region in one pass without creating rounded edges or feed marks, thereby maintaining both high productivity and manufacturing precision
Solution Approach 2:
The patent transitions from a shallow depth of focus (one-dimensional limitation) to a deep depth of focus that spans the entire width of the cutting edge region. This dimensional change in the depth of focus allows simultaneous processing of the entire cutting edge region, eliminating the need for multiple passes and preventing feed marks
2Reliability
If PCD, SCD or BLCBN materials are used for cutting tools, then high cutting performance is achieved, but these insulator materials cannot be processed by electric discharge machining and require lengthy grinding processes
Solution Approach 1:
The patent replaces the mechanical grinding process with a laser-based processing method. By using a laser beam with deep depth of focus to directly process the cutting edge region of PCD, SCD, or BLCBN materials, the manufacturing time is significantly reduced while maintaining the high cutting performance enabled by these advanced materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents feed marks and enhances the linearity of cutting edges, achieving a surface roughness of 0.2 µm or less, making the cutting tools suitable for mirror-finishing without edge chipping.
Implementation Method 1
producing and processing the cutting edge region along the ridge line of the edge with a first laser beam having a depth of focus equal to or deeper than a width of the cutting edge region
Data Source
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AI summary
A method for manufacturing a cutting tool having a rake face, a flank face, and an edge having a ridge line interconnecting the rake face and the flank face, wherein on the flank face there is a cutting edge region from the ridge line of the edge to a point A away therefrom on the side of the flank face by a distance X, the method comprising producing and processing the flank face with a laser, the producing and processing being producing and processing the cutting edge region along the ridge line of the edge with a first laser beam having a depth of focus equal to or deeper than a width of the cutting edge region when the distance X is the width of the cutting edge region, the distance X being 0.2 mm or more and 5 mm or less.