Laser Cutting Electron Removal for Plasma Re-Deposition Control

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Solution Overview

Problem

During laser cutting, silicon buildup on the substrate due to plasma re-deposition affects cutting efficiency and quality, as the energy transfer is hindered by increased electron density and plasma absorption, leading to reduced control over ablation morphology and increased cutting energy requirements.

Innovation Solution

A biased electrode is used to draw electrons from the plasma plume away from the substrate, supplemented by a vacuum port and/or blower to direct gas flow, reducing electron density and preventing material re-deposition, thereby improving laser cutting efficiency and quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser fluence is increased to improve ablation rate, then productivity increases, but manufacturing precision deteriorates due to plasma absorption and uncontrolled ablation morphology

Engineering Contradiction:
Improveablation rateVSAvoidkerf smoothness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A plasma plume management system acts as an intermediary between the laser beam and the substrate. By controlling the plasma plume dynamics through vacuum ports and gas flow, the system mediates the interaction between high-fluence laser radiation and the material, enabling high ablation rates while maintaining precision by preventing plasma-induced energy loss and morphological degradation

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the plasma plume parameters (density, temperature, composition) by controlling vacuum pressure and gas flow rates. This allows the system to operate in a regime where plasma absorption is minimized, enabling high fluence operation without the usual degradation in kerf smoothness and ablation morphology control

Inventive Principle:
Principle #35Parameter changes

2Productivity

If laser fluence is increased to improve ablation rate, then productivity increases, but use of energy increases due to plasma absorption

Engineering Contradiction:
Improveablation rateVSAvoidcutting energy requirement
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The plasma plume management system serves as an intermediary that optimizes energy transfer. By controlling plasma density through vacuum and gas flow, the system reduces parasitic plasma absorption, allowing more laser energy to reach the substrate and be converted into useful ablation work, thereby improving energy efficiency at high ablation rates

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

By dynamically adjusting plasma plume parameters (pressure, gas flow, composition), the system optimizes the energy coupling between laser and material. This enables high productivity operation with reduced energy waste in plasma heating, as the plasma is maintained at optimal density for energy transfer rather than acting as an energy sink

Inventive Principle:
Principle #35Parameter changes

3Productivity

If electron density increases with laser fluence, then ablation rate increases, but manufacturing precision deteriorates due to slower energy transfer from electrons to lattice

Engineering Contradiction:
Improveablation rateVSAvoidablation morphology control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The plasma plume management system acts as an intermediary that controls electron density and energy transfer dynamics. By regulating plasma conditions through vacuum and gas flow, the system ensures efficient electron-to-lattice energy transfer even at high electron densities, maintaining precise control over ablation morphology while achieving high ablation rates

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes plasma parameters (electron density, temperature, confinement) to optimize the energy transfer process. By maintaining optimal plasma conditions through controlled vacuum and gas flow, the system ensures that increased electron density translates to higher ablation rates without the usual degradation in energy transfer efficiency and morphological control

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces silicon re-deposition, enhances laser cutting speed, and maintains better processing quality by controlling electron density and energy transfer, leading to more efficient and effective laser cutting with fewer passes required.

Implementation Method 1

a plasma plume or cloud is formed by laser ablation

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

Energy transfer to the bulk material is governed by thermal diffusion

Methodology Applied
Scientific EffectEnergy transfer from electrons to lattice: Conduction (thermal)

Implementation Method 3

The laser intensity is influenced by plasma absorption

Methodology Applied
Scientific EffectPlasma absorption: Absorption (EM radiation)

Implementation Method 4

At least one electrode is biased to draw the electrons of the plasma plume or cloud towards the electrode and away from the substrate

Methodology Applied
Scientific EffectElectrostatic force: Electric Field

Data Source

PatentUS20230411179A1Laser Cutting With Electron Removal
Publication Date: 2023.12.21 SANDISK TECHNOLOGIES LLC
  • US20230411179A1 patent drawing
  • US20230411179A1 patent drawing
  • US20230411179A1 patent drawing

AI summary

The present disclosure generally relates to ensuring a plasma plume or cloud that forms during a laser cutting process does not lead to undesired re-deposition of material onto the substrate. At least one electrode is biased to draw the electrons of the plasma plume or cloud towards the electrode and away from the substrate. A vacuum port and/or a blower may be strategically located to ensure proper gas flow away from the substrate and hence, directing of the electrons away from the substrate. In so doing, material re-deposition is less likely to occur.