Laser Machining of Multi-Layer Cutting Inserts Without Layer Offset
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Solution Overview
Problem
The existing methods for laser processing of multi-layer cutting plates often result in inaccuracies due to mismatched layer thicknesses, leading to offsets between the hard material layer and the base material, which affects the quality of the cutting edge and flank geometries.
Innovation Solution
A method that involves measuring the actual layer thickness of the multi-layer workpiece blank after clamping and modifying the processing program accordingly to ensure precise adaptation of laser parameters and guidance, ensuring the removal geometry is adjusted based on the measured thickness, thereby preventing or reducing offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser processing is performed using a predetermined processing program based on nominal layer thickness, then the processing can be automated and efficient, but the manufacturing precision deteriorates due to mismatches between actual and nominal layer thicknesses
Solution Approach 1:
The invention measures the actual layer thickness of the hard material layer before laser processing begins. This preliminary measurement action allows the processing program to be adapted to the actual dimensions, ensuring high manufacturing precision while maintaining automated processing efficiency.
Solution Approach 2:
The invention dynamically adjusts the processing program parameters based on the measured actual layer thickness. By changing the removal geometry parameters according to the measured values, the system achieves both automated efficiency and high precision cutting edge quality.
2Adaptability or versatility
If the layer thickness varies irregularly across the workpiece, then the adaptability of the processing to real conditions improves, but the manufacturing precision deteriorates due to offsets between hard material layer and base material
Solution Approach 1:
The invention measures and processes each local area according to its actual layer thickness. By adapting the processing parameters to the specific local conditions of each measured area, the system maintains precise alignment between the hard material layer and base material despite variations in thickness across the workpiece.
Solution Approach 2:
The invention uses the measured actual layer thickness as feedback to adjust the processing program. This closed-loop approach ensures that the laser processing adapts to the actual conditions, preventing offsets and maintaining high alignment precision even when layer thickness varies irregularly.
3Manufacturing precision
If the processing program is modified based on measured layer thickness, then the manufacturing precision improves, but the device complexity increases due to additional measuring and control systems
Solution Approach 1:
The invention integrates the measuring device and processing device into a unified system that performs both measurement and laser processing functions. This multi-functional approach reduces overall system complexity while maintaining high manufacturing precision through adaptive processing based on measured values.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the quality of the cutting edges and flanks by ensuring the processing program is automatically adapted to the exact layer thickness, allowing for accurate removal and preventing offsets, even with irregular variations in layer thickness.
Implementation Method 1
a laser beam (106) is guided along the cutting edge precursor edge (104) and thus removes layer by layer
Data Source
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AI summary
The invention relates to a method for machining a multi-layer workpiece blank (3) by means of a laser beam, comprising the following steps: specifying a machining program for machining the workpiece blank according to an ablation geometry in order to generate a desired edge and/or surface geometry (13) using a laser machining device; tensioning the workpiece blank in the laser machining device and positioning the workpiece holder in a measuring position; measuring a thickness of at least one of the layers of the multi-layer workpiece blank (3); modifying the machining program in order to machine the multi-layer workpiece blank (3) according to the measured layer thickness with an consistent ablation geometry; and machining the tensioned workpiece blank (3) using the modified machining program via a laser of the laser machining device in order to generate the desired edge and/or surface geometry (13) with a cutting edge (12). The invention also relates to a correspondingly designed device.