Laser Cutting Control at Intersecting Lines on Thick Plates
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Solution Overview
Problem
Laser cutting processing on thick plates results in defective cuts when intersecting with previously processed lines due to thermal conduction issues, leading to uneven heating and melting of the workpiece.
Innovation Solution
A laser cutting method that decelerates the cutting speed before reaching intersecting lines, adjusts laser output to zero or minimum within a prescribed range, and accelerates back to initial speed after aligning with the line, using a control device to manage the laser processing head and oscillator output based on stored position data to prevent defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting processing is carried out at normal speed on thick plates, then processing efficiency is maintained, but defective processing occurs at intersecting positions due to thermal conduction issues
Solution Approach 1:
The laser cutting speed is dynamically adjusted based on the processing position. The control device decelerates the laser cutting speed before the laser beam reaches an intersecting position, maintains a reduced speed during the intersecting position processing, and then accelerates back to normal speed after passing the intersecting position. This dynamic speed adjustment ensures proper thermal conduction and prevents defective processing at intersecting positions while maintaining overall processing efficiency.
Solution Approach 2:
The laser cutting parameters (speed and output) are changed according to the processing position. The control device modifies the laser cutting speed parameter and laser output parameter based on whether the current position is an intersecting position or not. This parameter change approach allows optimal processing conditions to be applied at different positions, preventing defects at intersecting positions while maintaining efficiency elsewhere.
2Manufacturing precision
If laser cutting speed is reduced to prevent defective processing at intersecting positions, then cutting quality is improved, but overall processing time increases
Solution Approach 1:
The laser cutting speed is adjusted locally only at intersecting positions rather than reducing speed throughout the entire processing path. The control device identifies specific intersecting positions and applies speed reduction only at those locations, while maintaining normal processing speed at all other positions. This localized approach ensures cutting quality at critical positions without significantly increasing total processing time.
Solution Approach 2:
The control device performs preliminary identification of intersecting positions using stored position data before the laser cutting process begins. By pre-calculating and marking all intersecting positions, the system can smoothly transition to speed adjustment at the appropriate moments, avoiding unnecessary speed reductions and minimizing the impact on overall processing time.
3Productivity
If laser beam continuously processes thick plate material, then processing efficiency is maintained, but thermal conduction causes uneven heating and defective cuts at intersecting positions
Solution Approach 1:
The laser cutting process applies periodic modulation of speed and output parameters. The control device creates a periodic pattern of normal speed/output followed by reduced speed/output when approaching intersecting positions, then returns to normal speed/output after passing them. This periodic adjustment ensures uniform thermal conduction and heating at intersecting positions while maintaining overall processing efficiency through the majority of the cutting path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents defective laser cutting by ensuring uniform preheating and processing of thick plates, maintaining quality even at intersecting positions, thereby resolving thermal conduction-related issues.
Implementation Method 1
when the laser cutting processing for a work W of a thick plate is carried out in a direction of an arrow A, a thermal conduction takes place from a laser cutting processing position B to surroundings
Implementation Method 2
a thermal cutting on a lower surface side is carried out with a delay from an upper surface side of the work W
Data Source
Figure 1
Figure 2(a)~2(b)
Figure 3(a)~3(c)
AI summary
At a time of carrying out a laser cutting processing in a direction intersecting with a processing line (L) at which the laser cutting processing for a work (W) has been carried out, a laser cutting speed (V) is decelerated before a laser beam (LB) reaches the processing line (L) at an initial laser cutting speed (V), and the laser cutting speed (V) is accelerated when an axial center of the laser beam (LB) is positioned within a prescribed range in vicinity of a central position of the processing line (L), and the laser cutting speed (V) is returned to the initial laser cutting speed (V), in vicinity of a position at which the axial center of the laser beam (LB) crosses the processing line (L). Also, when the axial center of the laser beam (LB) and the central position of the processing line (L) almost coincide, the laser output (P) is made to be almost zero.