Laser Cutting Laminated Substrates Using Light-Absorbing Interlayer
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Solution Overview
Problem
Conventional laser cutting methods for laminated substrates face challenges such as reduced throughput, poor cutting accuracy, and increased manufacturing costs due to the need for separate laser irradiation of each substrate and the generation of chippings, which require additional processing steps like washing and polishing.
Innovation Solution
A laser cutting method that uses a pattern member with light-absorbing properties between substrates to absorb transmitted laser wavelengths, allowing simultaneous cutting of both substrates from one side, thereby improving accuracy and productivity while eliminating the need for conductive gap materials and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate laser irradiation is performed on each substrate, then cutting can be achieved, but throughput decreases and productivity is reduced
Solution Approach 1:
The patent merges the cutting operations for multiple substrates into a single laser irradiation process. By positioning substrates in a stack and irradiating them simultaneously from one side, the method combines what would otherwise be separate cutting operations into one unified process, thereby improving throughput while maintaining cutting accuracy through the use of a light-absorbing member for precise thermal stress generation.
Solution Approach 2:
The patent transitions from irradiating substrates from opposite sides (two-dimensional approach) to irradiating from a single side (one-dimensional approach) by introducing a light-absorbing member between substrates. This dimensional change allows the laser to pass through transparent substrates and be absorbed by the member, generating thermal stress that propagates through all substrates in the stack simultaneously, thus improving productivity without sacrificing cutting precision.
2Manufacturing precision
If paint is applied to substrates for laser cutting, then chippings are eliminated, but additional processing steps are required and productivity decreases
Solution Approach 1:
The patent employs a light-absorbing member that is already present in the substrate stack (either as a built-in component or pre-positioned element) to perform the function of paint absorption. This self-service approach eliminates the need for separate paint application steps while maintaining the benefit of chip-free cutting surfaces, as the thermal stress is generated internally within the substrate stack rather than requiring external coating materials.
Solution Approach 2:
The patent extracts the light-absorbing function from the substrate surface (where it would require paint application) and places it within the substrate stack as a dedicated light-absorbing member. This extraction allows the substrates to remain transparent to the laser wavelength while providing the necessary absorption capability through the member, thereby eliminating the need for paint application steps and improving productivity.
3Productivity
If diamond cutter is used for cutting, then cutting can be achieved, but chippings are generated and panel strength deteriorates
Solution Approach 1:
The patent replaces the mechanical cutting system (diamond cutter) with a thermal field-based laser cutting system. Instead of using mechanical force to fracture the substrate and cause chippings, the laser generates thermal stress through the light-absorbing member, which creates controlled cracking without mechanical contact. This substitution eliminates chipping generation and preserves panel strength while maintaining cutting efficiency.
Solution Approach 2:
The patent utilizes phase transitions in the form of thermal stress generation and propagation. The laser energy is converted to thermal energy in the light-absorbing member, causing localized heating and subsequent thermal stress that propagates through the substrates. This thermal phase transition mechanism creates clean cracks without the mechanical impact and chipping associated with diamond cutter methods, thereby preserving panel strength.
4Manufacturing precision
If laser wavelength is chosen to transmit substrates, then cutting accuracy improves, but the method is limited to single substrate cutting
Solution Approach 1:
The patent introduces a light-absorbing member as an intermediary element between the laser source and the substrates. This member serves as a mediator that absorbs the laser energy and converts it to thermal stress, which then propagates through the transparent substrates. The intermediary enables the laser wavelength to transmit through the substrates for accurate cutting while simultaneously providing the absorption capability needed for multi-substrate processing, thus resolving the contradiction between transmission and adaptability.
Solution Approach 2:
The patent employs a composite structure consisting of multiple transparent substrates combined with a light-absorbing member. This composite material approach allows the system to leverage the transparency of the substrates for laser transmission and accuracy while incorporating the light-absorbing properties of the member for thermal stress generation. The composite structure enables the method to be applied to laminated substrates while maintaining cutting accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances cutting accuracy, increases productivity, and reduces manufacturing costs by allowing simultaneous cutting of both substrates with improved durability and reduced thermal stress, eliminating the need for additional processing steps like washing and polishing.
Implementation Method 1
providing a light-absorbing member that absorbs light of a wavelength that transmits each of the substrates, between the substrates along a cutting position of a laminated substrate
Implementation Method 2
irradiating a laser of a wavelength that transmits each of the substrates along the light-absorbing member, thereby cutting the laminated substrate along the light-absorbing member
Data Source
AI summary
To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.