Laser Cutting Multi-Piece Boards Using Dual-Surface Conductive Patterns
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Solution Overview
Problem
Current methods for manufacturing multi-piece boards in the wiring board industry face challenges in accurately cutting and fitting piece boards into frames due to alignment errors and protrusions during the laser cutting process, leading to inefficiencies and reduced precision.
Innovation Solution
A method involving the formation of conductive patterns on both surfaces of the board, with laser irradiation from both sides to cut out piece boards, ensuring precise alignment and fitting by using the conductive patterns as masks to minimize processing errors and protrusions, and subsequent adhesive application for secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser cutting is performed from one side only, then the process is simple and fast, but alignment accuracy deteriorates and protrusions occur at the cut edges
Solution Approach 1:
The laser cutting process is segmented into two separate operations: first laser irradiation from the first surface and second laser irradiation from the second surface. This segmentation allows each laser pass to focus on creating a clean edge from its respective side, eliminating the protrusion problem that occurs with single-sided cutting while maintaining process efficiency
Solution Approach 2:
The cutting approach transitions from a single-dimensional (one-sided) laser irradiation to a two-dimensional approach by irradiating from both surfaces of the board. This dimensional change enables precise alignment by having conductive patterns on both surfaces serve as reference markers for the laser positioning system
2Manufacturing precision
If conductive patterns are formed on both surfaces with laser irradiation from both sides, then alignment accuracy and bonding strength are enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
Conductive patterns are formed on both surfaces of the board before the laser cutting process. These pre-formed patterns serve as alignment references that guide the laser positioning system, ensuring high precision cutting and fitting without requiring complex real-time adjustment mechanisms during the cutting operation
Solution Approach 2:
The conductive patterns on both surfaces automatically serve as self-aligning references for the laser system. The laser positioning is guided by detecting these pre-existing patterns, allowing the system to self-correct and maintain precise alignment without external intervention or complex control algorithms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances alignment accuracy and bonding strength between piece boards and frames, improving the manufacturing efficiency and quality of multi-piece boards by reducing alignment errors and ensuring precise fitting.
Implementation Method 1
irradiating laser upon the first surface and second surface of the board along the first conductive pattern and the second conductive pattern such that the piece board is cut out from the board
Implementation Method 2
irradiating laser upon the first surface and second surface of the board along the first conductive pattern and the second conductive pattern such that the piece board is cut out from the board
Data Source
AI summary
A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.