Laser Cutting Part Transport with Alternating Dual Holding Devices
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Solution Overview
Problem
In laser cutting installations where workpiece parts are moved in one direction and the cutting head moves perpendicularly, there is a delay in the availability of holding devices for transporting cut-free parts, especially when dealing with numerous small parts, leading to inefficiencies in the processing sequence.
Innovation Solution
The method involves dividing the workpiece panel into two halves and using separate holding devices on different guides to transport workpiece parts from each half alternately, optimizing the cutting and transporting sequence to avoid collisions and minimize positioning times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single holding device transports workpiece parts sequentially, then the device structure remains simple, but the processing speed and productivity decrease due to waiting times
Solution Approach 1:
The workpiece is divided into two halves (first half and second half) along a central line, and corresponding holding devices are assigned to each half. This segmentation allows parallel processing of workpiece parts from different halves, eliminating waiting times and increasing productivity without requiring a completely complex new system architecture
2Productivity
If multiple holding devices operate simultaneously on the same guide, then transport capacity increases, but collisions and interference between devices occur
Solution Approach 1:
The guide system is segmented into multiple guides (first guide and second guide), with holding devices operating on separate guides for different halves of the workpiece. This spatial segmentation eliminates collisions while maintaining high transport capacity
Solution Approach 2:
The solution moves from a single-dimensional sequential transport approach to a multi-dimensional parallel transport system by introducing multiple guides and assigning holding devices to different spatial zones (first half and second half of the workpiece), enabling simultaneous operations without interference
3Productivity
If the holding device waits for cutting to complete before transporting, then positioning is simplified, but processing time increases due to idle waiting
Solution Approach 1:
The holding device positions itself at the cutting area before the cutting operation completes, and immediately transports the workpiece part as soon as cutting is finished. This preliminary positioning eliminates idle waiting time while the coordination is managed by the control unit
Solution Approach 2:
The system maintains continuous useful action by ensuring that while one holding device is transporting a workpiece part, another holding device is already positioned and ready to transport the next part. This continuity eliminates idle waiting periods and maximizes productivity
Data Source
AI summary
A method for transporting workpiece parts out of a cutting area of a laser cutting machine includes: moving a first holding device for holding workpiece parts along a first guide in a transporting direction transverse to a direction of movement of a laser cutting head, and moving a second holding device along a second guide in the transporting direction transverse to the direction of movement of the laser cutting head. First workpiece parts, which are cut within the cutting area from a first half of a workpiece, are transported from the cutting area into the storage area by the first holding device. Second workpiece parts, which are cut within the cutting area from a second half of the workpiece, are transported from the cutting area into storage area by the second holding device. The transportation of the first and second workpiece parts takes place in alternation.