Laser Cutting Path Correction for Belt-Driven Substrate Drift
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Solution Overview
Problem
Existing laser cutting devices for display panels face poor cutting accuracy due to uneven friction forces from conveying belts, leading to deviations in the cutting line and compromised product quality, especially when cutting through ITO pattern layers.
Innovation Solution
The implementation of a laser cutting device with first and second counters arranged opposite each other on the work table, driven by the substrate's side edges to count and determine a corrected cutting motion track, which is used to guide the laser cutter, along with a control apparatus that adjusts the cutting path based on these counts, reducing wear and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If blind cutting is used without considering conveying belt friction, then the cutting process is simple, but cutting accuracy deteriorates due to substrate displacement
Solution Approach 1:
The system performs preliminary actions by placing markers on the substrate before conveying, and uses counters to pre-measure the actual conveying distance. This allows the cutting path to be corrected in advance based on measured displacement, resolving the contradiction by adding measurement infrastructure that enables accurate cutting without overly complicating the overall process.
Solution Approach 2:
The patent implements feedback by using counters to detect the actual conveying distance and comparing it with the expected distance. The control apparatus then adjusts the cutting path based on this feedback information, ensuring cutting accuracy despite variations in conveying belt friction. This feedback mechanism resolves the contradiction by adding intelligent adjustment capability.
2Productivity
If conveying belts are used to transport substrate, then substrate transport is efficient, but cutting accuracy deteriorates due to uneven friction forces causing displacement
Solution Approach 1:
Markers are placed on the substrate before conveying, and the counters measure the actual conveying distance in advance. This preliminary measurement allows the system to compensate for displacement caused by uneven friction, maintaining cutting accuracy while preserving the efficiency of belt conveying.
Solution Approach 2:
The system changes the parameter of cutting path coordinates based on measured conveying displacement. By adjusting the cutting parameters according to actual substrate position, the system maintains cutting accuracy despite variations in conveying conditions, resolving the contradiction between efficient conveying and precise cutting.
3Measurement precision
If markers are placed on substrate with ITO pattern layer, then cutting path can be identified, but ITO pattern layer deteriorates due to easy damage
Solution Approach 1:
The patent uses markers as intermediaries that are placed on the substrate surface. These markers serve as the interface between the conveying system and the cutting system, enabling precise cutting path identification without requiring direct modification of the ITO pattern layer itself, thus protecting the delicate ITO layer while maintaining measurement capability.
Solution Approach 2:
Instead of directly marking or modifying the ITO pattern layer, the system uses separate markers that copy or represent the cutting positions. This indirect approach allows cutting path identification without compromising the integrity of the ITO pattern layer, resolving the contradiction between measurement needs and material protection.
4Manufacturing precision
If counters are added to measure conveying distance, then cutting accuracy is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement systems with simpler counter-based detection. The counters provide a straightforward electronic method for measuring conveying distance, avoiding the need for complex mechanical encoders or sensors, thus improving cutting accuracy while minimizing the increase in device complexity.
Data Source
AI summary
A laser cutting device comprises: a conveying mechanism (1) comprising a feeding end and a discharging end; a working platform (2) disposed at the discharging end of the conveying mechanism (1); a first counter (3) and a second counter (4) oppositely disposed at a side of the working platform (2) near the discharging end of the conveying mechanism (1) and driven respectively by two opposite side edges of a substrate (6) to rotate for counting; a laser cutter (5) disposed above the working platform (2); a control device (13) for determining a modified cutting motion path of the laser cutter according to a set cutting path, and starting and ending times of counting values of the first counter (3) and second counter (4), and for controlling the laser cutter to cut the substrate (6) according to the modified cutting motion path.