Laser Cutting Protection Pattern for Flexible Display Substrates

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Solution Overview

Problem

Laser cutting of flexible display substrates can cause local overheating, leading to cracks in the inorganic layer due to thermal expansion and contraction, which allows water vapor to penetrate and result in component failure.

Innovation Solution

A protection pattern made of laser melting or hot-melt materials is applied over the laser cutting area, covering the inorganic layer to prevent cracks and water vapor ingress, with the pattern being slightly larger than the cutting line to ensure effective encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser cutting is used to separate flexible display substrates, then productivity is improved, but cracks occur in the inorganic layer due to thermal expansion and contraction

Engineering Contradiction:
Improvesubstrate separation efficiencyVSAvoidinorganic layer integrity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

A protection pattern made of laser melting or hot-melt materials is introduced as an intermediary layer between the laser beam and the inorganic layer. This protection pattern absorbs the laser energy and prevents direct thermal interaction with the inorganic layer, thereby avoiding cracks while enabling safe laser cutting for high productivity

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If laser cutting is applied to achieve high throughput, then manufacturing speed increases, but local overheating causes cracks and water vapor penetration

Engineering Contradiction:
Improvecutting speedVSAvoiddisplay component reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The protection pattern serves as a thermal barrier that mediates between the high-energy laser beam and the sensitive inorganic layer, allowing fast cutting speeds while preventing overheating and maintaining display component reliability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protection pattern is formed on the inorganic layer before laser cutting occurs. This preliminary protective layer is already in place to prevent the harmful effects of laser-induced thermal expansion and contraction, ensuring reliability even at high cutting speeds

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a protection pattern is added to prevent cracks, then reliability improves, but device complexity increases

Engineering Contradiction:
Improvecrack preventionVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protection pattern is applied locally only in the laser cutting area where cracks are most likely to occur, rather than covering the entire substrate. This localized approach provides targeted protection while minimizing the increase in device complexity

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The protection pattern uses simple, inexpensive materials (laser melting or hot-melt materials) that are easy to apply and remove. Although it adds a layer to the structure, the material cost and processing complexity are minimal compared to the reliability gain

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The protection pattern effectively prevents cracks and water vapor penetration during laser cutting, enhancing the reliability and yield of the display substrate by melting and quickly cooling to cover the cutting edge.

Implementation Method 1

A protection pattern made of laser melting materials or laser hot-melt materials is applied over the laser cutting area

Methodology Applied
Scientific EffectLaser absorption: Absorption (EM radiation)

Implementation Method 2

The protection pattern is made of laser melting materials or laser hot-melt materials

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

cracks may occur in an edge of an inorganic layer of the flexible display substrate due to instantaneous thermal expansion and contraction

Methodology Applied
Scientific EffectThermal expansion and contraction: Thermal Expansion

Implementation Method 4

The protection pattern covers a laser cutting area between the plurality of spaced display components

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS10476042B2Display-substrate motherboard, display substrate, method for manufacturing the same and display apparatus
Publication Date: 2019.11.12 BOE TECHNOLOGY GROUP CO LTD
  • US10476042B2 patent drawing
  • US10476042B2 patent drawing
  • US10476042B2 patent drawing

AI summary

The present disclosure provides a display-substrate motherboard, a display substrate, a method for manufacturing the same and a display apparatus. The display-substrate motherboard includes a base substrate, an inorganic layer on the base substrate, a plurality of spaced display components on the inorganic layer, and a protection pattern on the inorganic layer. The protection pattern covers a laser cutting area between the plurality of spaced display components.