Laser Cutting Substrate Auxiliary Split Lines
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Solution Overview
Problem
Conventional glass cutting methods, such as wheel cutting and CO2 laser cutting, are limited to simple shapes and fixed cutting sequences, unable to efficiently cut irregular shapes and often result in substrate rupture during the cutting process.
Innovation Solution
A method and device that use laser cutting to engrave first and second parallel lines, shaped lines, and auxiliary split lines on a substrate, with the auxiliary split lines positioned outside the shaped lines and within a specific distance threshold, to increase stress rupture points and improve cutting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wheel cutting or CO2 laser cutting methods are used, then cutting paths are limited to horizontal and vertical linear paths, but this restricts the ability to cut irregular shapes and increases substrate rupture risk
Solution Approach 1:
The cutting path is segmented into multiple types: first parallel lines, second parallel lines, shaped lines, and auxiliary split lines. This segmentation allows the system to handle both regular and irregular shapes by combining different line types, thereby improving adaptability while maintaining substrate integrity through controlled stress distribution.
Solution Approach 2:
The invention introduces curved shaped lines and auxiliary split lines that extend beyond simple horizontal and vertical paths. By adding dimensional complexity to the cutting path (curved lines, irregular shapes), the system can now cut irregular shapes while the auxiliary split lines provide stress relief points to prevent rupture.
2Productivity
If single cutting paths with fixed sequences are used, then cutting efficiency is maintained, but the ability to perform irregular shape cutting is lost
Solution Approach 1:
The cutting path is made dynamic by allowing the system to automatically select and combine different line types (parallel lines, shaped lines, auxiliary split lines) based on the substrate pattern. This dynamic path selection enables irregular shape cutting while maintaining efficiency through automated route optimization.
Solution Approach 2:
The laser cutting device is designed with multi-functional cutting capabilities, able to execute multiple types of cutting paths (first parallel lines, second parallel lines, shaped lines, auxiliary split lines) within a single system. This universality allows the same device to handle both regular and irregular shapes efficiently.
3Reliability
If auxiliary split lines are added close to shaped lines, then stress rupture points increase and substrate rupture decreases, but cutting path complexity increases
Solution Approach 1:
Auxiliary split lines are pre-positioned at calculated distances from shaped lines based on substrate properties. This preliminary action creates stress rupture points in advance, ensuring that when cutting occurs, the stress is distributed through these pre-planned points, preventing unexpected substrate rupture while maintaining systematic path planning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient cutting of irregular shapes, reduces substrate rupture, and enables complete separation of substrates with minimal material waste, using reasonable and ingenious cutting paths.
Implementation Method 1
a laser knife and a controller connected with the laser knife... the first parallel lines, the second parallel lines, the shaped lines and the auxiliary split lines are engraved on the substrate by the laser knife
Implementation Method 2
engraving a plurality of first parallel lines along a first direction, a plurality of second parallel lines along a second direction, and shaped lines for sub-substrates on a substrate
Implementation Method 3
regions for engraving a shape of the sub-substrates are encircled between the intercrossed first parallel lines and second parallel lines... the minimum distance from end portions, towards the shaped lines, of the auxiliary split lines to the shaped lines falls within the first default threshold
Data Source
AI summary
A method for cutting a substrate by laser and a laser cutting device are disclosed. The method includes the following steps: engraving a plurality of intercrossed first parallel lines and second parallel lines on a substrate, in which regions for engraving a shape of sub-substrates are encircled between the first parallel lines and the second parallel lines; shaped lines are disposed in the regions; auxiliary split lines are engraved on an outside of the shaped lines; and a minimum distance from end portions of the auxiliary split lines towards the shaped lines to the shaped lines falls within the first default threshold. The method adopts the arrangement of the parallel lines and the auxiliary split lines to help splitting the substrate, and can increase stress rupture points in the process of cutting the substrate, avoid the phenomenon of rupture of the glass substrate in the cutting process, and effectively improve the yield of substrate cutting.