Laser Cutting Substrate Thickness Variation Damage
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Solution Overview
Problem
Existing display device manufacturing processes face challenges in minimizing damage and carbonization, particularly when cutting substrates with varying thicknesses, leading to inefficiencies and potential damage during the laser cutting process.
Innovation Solution
The method involves preparing a substrate with areas of different thicknesses and using laser beams of specific intensities to cut along designated cutting lines, optimizing the cutting process to minimize damage and carbonization by adjusting laser beam intensity based on the thickness of each area, thereby preventing substrate damage and carbonization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single laser beam intensity is used for cutting substrates with varying thicknesses, then the cutting process is simplified, but damage and carbonization occur on thinner areas
Solution Approach 1:
The patent applies different laser beam intensities to different areas of the substrate based on thickness variations. The cutting method divides the substrate into first, second, and third areas with different thicknesses, and uses corresponding first, second, and third laser beam intensities for each area, ensuring optimal cutting without damage or carbonization in each region
Solution Approach 2:
The patent changes the laser beam intensity parameter according to the substrate thickness in different areas. By adjusting the intensity from first (highest) to second (intermediate) to third (lowest) levels across different thickness zones, the method prevents overheating and carbonization while maintaining effective cutting
2Manufacturing precision
If high laser beam intensity is used to cut through thicker substrate areas, then cutting capability is improved, but carbonization and damage occur on thinner areas
Solution Approach 1:
The patent applies different laser beam intensities to different areas of the substrate based on thickness variations. The cutting method divides the substrate into first, second, and third areas with different thicknesses, and uses corresponding first, second, and third laser beam intensities for each area, ensuring optimal cutting without damage or carbonization in each region
Solution Approach 2:
The patent uses a tiered approach where the first laser beam intensity (excessive for thin areas) is applied only to the first area with greatest thickness, the second intensity is applied to the second area, and the third intensity (partial action) is applied to the third area, preventing excessive energy input that would cause carbonization
3Object-affected harmful factors
If multiple laser beam intensities are used for different substrate areas, then damage and carbonization are minimized, but the cutting process becomes more complex
Solution Approach 1:
The patent segments the substrate into distinct first, second, and third areas based on thickness variations, and corresponds each segment with a specific laser beam intensity level. This segmentation allows systematic application of appropriate energy levels to each zone, managing complexity through structured division
Solution Approach 2:
The cutting method incorporates feedback by identifying substrate thickness in different areas and selecting appropriate laser beam intensities accordingly. The process adjusts energy input based on the actual substrate characteristics, preventing damage through responsive control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise cutting of substrates with varying thicknesses, reducing damage and carbonization, and enabling the production of display devices with minimized defects, resulting in improved manufacturing efficiency and product quality.
Implementation Method 1
irradiating a first laser beam in a first direction along a first cutting line of the first area; irradiating a second laser beam in a second direction which is from the second area toward the first area along a second cutting line of the first area
Data Source
AI summary
A display device in which damage and carbonization of a display substrate is substantially minimized and a method of manufacturing the display device are provided. A display device includes: a substrate including a first area having a first thickness and a second area having a second thickness which is different from the first thickness; a display layer at the first area of the substrate; and a functional member on the display layer at the first area. The first area and the second area are arranged along a first direction, the substrate includes a protruding portion at the second area, and the protruding portion includes a side portion having an inclination of about 5 degrees or more with respect to the first direction toward a second direction which intersects the first direction.