Laser Cutting Thick-Film Heating Elements
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Solution Overview
Problem
Existing methods for processing electrical components with layer structures, such as thick-film heating elements, face challenges in precisely adjusting electrical resistance values and safely severing functional layers without damaging underlying insulating layers, which can compromise electrical insulation and high-voltage testing.
Innovation Solution
A method involving the creation of a height profile of the functional layer using a measuring laser, followed by precise adjustment and severing with a separating laser, allowing for complete severance of the functional layer while sparing or partially severing underlying layers to maintain insulation, with options for cutting depth and laser parameters to ensure accurate and safe material removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser is used to sever the functional layer to adjust electrical resistance, then the electrical resistance can be precisely adjusted, but there is a risk of damaging underlying insulating layers which compromises electrical insulation
Solution Approach 1:
The patent creates a height profile of the functional layer before severing it. This preliminary measurement allows the laser processing system to know exactly where the functional layer boundaries are located, enabling precise cutting without penetrating into underlying insulating layers. The height profile data is used to adjust laser parameters and cutting depth in advance.
Solution Approach 2:
The patent uses optical detection to measure the height profile of the functional layer and provides feedback to the laser control system. This closed-loop feedback mechanism allows real-time adjustment of laser cutting parameters based on actual layer thickness and position, ensuring complete severance of the functional layer while preventing damage to insulating layers beneath.
2Manufacturing precision
If the functional layer is completely severed to adjust resistance, then the electrical resistance value is precisely set, but underlying insulating layers may be damaged impairing electrical insulation properties
Solution Approach 1:
The system creates a height profile of the functional layer before laser severing to determine the exact cutting depth required. This preliminary action ensures that the laser cuts completely through the functional layer while stopping before damaging underlying insulating layers, thus achieving complete severance without harmful side effects.
Solution Approach 2:
The patent applies different processing approaches to different regions: the functional layer is completely severed to achieve precise resistance adjustment, while the underlying insulating layers are protected from damage. The height profile information enables localized control of laser penetration depth to achieve different quality outcomes in different layers.
3Reliability
If laser parameters are increased to ensure complete severance of the functional layer, then severance reliability improves, but risk of damaging underlying layers increases
Solution Approach 1:
The optical detection system measures the actual height profile of the functional layer and provides feedback to adjust laser parameters dynamically. This feedback control ensures that laser power and duration are optimized for complete severance of the functional layer without excessive energy that could damage underlying insulating layers.
Solution Approach 2:
The patent changes laser parameters (power, pulse duration, scanning speed) based on the measured height profile of the functional layer. By adapting parameters to the actual layer thickness and material properties, the system achieves reliable complete severance while minimizing the risk of damaging underlying layers through excessive parameter values.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise adjustment and severance of electrical components, ensuring complete functional layer removal without impairing insulating layers, thus maintaining electrical insulation and passing high-voltage tests, while allowing for flexible cutting strategies based on component specifications.
Implementation Method 1
a height profile of the functional layer above the plane or top side of the carrier is created at the point at which the functional layer is to be severed
Implementation Method 2
the functional layer is completely severed using a separating laser
Implementation Method 3
this separating laser is adjusted in such a way that it completely severs the functional layer
Data Source
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AI summary
In a method for processing an electrical component with a layered structure, in particular a heating device with a thick-film heating element, in which at least one functional layer is applied to a substrate and is to be completely cut through by means of a cutting laser, a height profile of the functional layer above the plane of the substrate is first created at the point where the cut is to take place. The information of the height profile of the functional layer is given to a controller for a cutting laser, and the cutting laser is set using known layer parameters of the functional layer so that it completely cuts through the functional layer according to the height profile, but does not remove material deeper into it, in particular does not cut through any insulating or dielectric layer.