Conductive Pattern Composition via Laser Decomposition
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Solution Overview
Problem
Current methods for forming fine conductive patterns on polymer resin substrates are complex and inefficient, making it difficult to achieve high-quality conductive patterns for applications like mobile phone antennas and RFID tags.
Innovation Solution
A composition comprising a polymer resin and a non-conductive metal compound with a specific three-dimensional structure, which forms metal cores upon electromagnetic irradiation, allowing for the creation of a conductive pattern through chemical reduction or electroless plating, simplifying the process and enhancing pattern quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photolithography or conductive paste printing is used to form conductive patterns on polymer resin substrates, then conductive patterns can be formed, but the process becomes complicated and equipment requirements increase
Solution Approach 1:
The patent replaces complex mechanical photolithography systems with a chemical-based solution. A metal complex compound is incorporated into the polymer resin, and selective laser irradiation triggers decomposition to form metal particles that serve as conductive patterns, eliminating the need for traditional photolithography equipment and simplifying the manufacturing process
Solution Approach 2:
The metal complex compound is pre-incorporated into the polymer resin substrate before processing. This preliminary incorporation allows the conductive pattern formation to occur in-situ through selective decomposition, eliminating the need for separate metal deposition steps and reducing overall process complexity
2Manufacturing precision
If traditional methods are used to form fine conductive patterns, then conductive patterns can be created, but achieving excellent fine conductive patterns becomes difficult
Solution Approach 1:
The patent applies local quality by using selective laser irradiation to decompose the metal complex compound only in specific predetermined regions of the polymer resin substrate. This creates conductive patterns with precise spatial control and fine line widths, as the metal particles form only where the laser energy is applied, enabling high manufacturing precision
Solution Approach 2:
The patent utilizes parameter changes by controlling laser irradiation parameters (wavelength, power, scanning speed) to precisely control the decomposition of the metal complex compound. By optimizing these parameters, excellent fine conductive patterns with high reliability can be formed, as the laser parameters directly influence the size, distribution, and morphology of the resulting metal particles
3Productivity
If metal layers are formed on polymer resin substrates using conventional methods, then conductive patterns can be achieved, but the process requires too many steps
Solution Approach 1:
The patent merges multiple steps into one by combining the metal complex compound incorporation, pattern formation, and conductive layer creation into a single integrated process. The metal complex is embedded in the resin, and selective laser irradiation simultaneously achieves pattern definition and conductive material formation, eliminating separate metal deposition and patterning steps
Solution Approach 2:
The patent extracts the metal component from a separate deposition process and incorporates it directly into the polymer resin matrix in the form of a metal complex compound. This extraction allows the conductive material to be formed in-situ through decomposition, reducing the number of process steps and improving production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively forms fine conductive patterns on polymer resin substrates with high adhesion and quality, suitable for various applications such as mobile phone antennas and RFID tags, using a simpler and more efficient process compared to existing technologies.
Implementation Method 1
a non-conductive metal compound containing a first metal and a second metal... wherein a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation
Implementation Method 2
The composition for forming the conductive pattern may exhibit reflectivity of approximately 25% or less, or approximately 10 to 25% with respect to a laser electromagnetic wave having a wavelength of approximately 1000 nm to 1200 nm
Data Source
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AI summary
The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.