Laser Deflector for Semiconductor Link Processing
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Solution Overview
Problem
Conventional semiconductor link processing systems face limitations in throughput due to constraints in stage acceleration, laser pulse repetition frequency, and the complexity of multiple beam systems, making it difficult to efficiently process a large number of links on semiconductor wafers.
Innovation Solution
A laser processing system that uses a deflector to selectively deflect laser pulses among laterally spaced rows of links within a processing window, allowing multiple links to be processed simultaneously with a single pass, utilizing a high-speed beam deflecting device to efficiently deliver pulses and reduce the need for extensive stage movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single laser pulse is focused at each link position with sequential processing, then manufacturing precision is maintained, but productivity is limited due to stage acceleration constraints and processing time
Solution Approach 1:
The patent segments the laser processing into multiple independent beam paths, each capable of processing different link rows simultaneously. The laser beam is split into multiple beams that can be independently directed to different target locations, enabling parallel processing of multiple links without compromising precision.
Solution Approach 2:
The patent combines multiple laser beam paths into a single processing system that can operate in parallel. By merging the capabilities of multiple beams under unified control, the system achieves high throughput while maintaining the precision of individual link severing through coordinated beam delivery.
2Productivity
If multiple beam systems are used to process multiple links simultaneously, then productivity increases, but device complexity increases due to multiple beam paths and synchronization requirements
Solution Approach 1:
The patent employs a single laser source that serves multiple functions by generating beams for different processing tasks simultaneously. The laser system is configured to provide multiple beam paths from one source, reducing the need for multiple independent laser systems and simplifying overall device complexity while maintaining high productivity.
Solution Approach 2:
The patent uses beam combining optics and synchronization control as intermediaries to coordinate multiple beam paths. These intermediary components manage the complexity of multiple beams by providing unified control and coordination, allowing simultaneous processing without requiring complex independent control systems for each beam.
3Productivity
If stage velocity is increased to process more links per pass, then productivity improves, but manufacturing precision deteriorates due to motion control challenges and positioning accuracy
Solution Approach 1:
The patent replaces reliance on high stage velocity with a stationary or slowly moving stage combined with rapidly steerable laser beams. The mechanical motion is substituted with optical beam deflection using acousto-optic deflectors or galvanometric mirrors, which can change beam position much faster than mechanical stages can move, thereby maintaining precision while increasing productivity.
Solution Approach 2:
The patent introduces dynamic beam steering capabilities that allow the laser beams to adapt their positions in real-time during the processing pass. The beam directions are dynamically adjusted to track and process links at optimal positions without requiring the stage to move at high speeds, maintaining positioning accuracy while enabling faster processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases throughput by allowing multiple link banks to be processed in a single pass, reducing processing time, and enabling the use of lower-cost, simpler motion stages while maintaining accuracy, thus overcoming the limitations of traditional systems.
Implementation Method 1
a laser-based link processing system can be employed to remove selected links
Implementation Method 2
uses a deflector to selectively deflect laser pulses among laterally spaced rows of links within a processing window
Data Source
AI summary
Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.