Miniaturized Coil Manufacturing via Laser Substrate Detachment
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Solution Overview
Problem
Traditional coil manufacturing methods fail to produce high-performance, miniaturized coils for modern electronic devices due to size, weight, and internal resistance issues, making it difficult to meet the demands of compactness and efficiency in electronic products.
Innovation Solution
A method involving bonding a metal sheet to a laser-transmitting substrate, cutting a coil pattern using a laser, and forming an encapsulation layer to create a miniaturized coil with controlled pitch and dimensions, utilizing a laser-transmitting substrate for easy removal and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional microelectronic technology is used to manufacture coils on plane substrates, then manufacturing simplicity is maintained, but coil miniaturization and performance improvement are limited
Solution Approach 1:
The patent replaces conventional mechanical microelectronic manufacturing methods with laser-based processing. The laser transmits through the substrate to precisely cut and shape the coil pattern on the metal foil, enabling miniaturization with high precision while avoiding the limitations of traditional mechanical approaches
Solution Approach 2:
The patent introduces a laser-transmitting substrate as an intermediary medium. This substrate allows laser energy to pass through to the metal foil for precise pattern formation, then can be easily removed after processing, facilitating miniaturization without permanently complicating the device structure
2Volume of moving object
If traditional coil structures are used, then structural simplicity is maintained, but size and weight increase
Solution Approach 1:
The patent transitions from planar coil patterns to three-dimensional coiled structures by wrapping metal foil around a mandrel or forming helical patterns. This dimensional change enables significant volume reduction while maintaining electrical performance, creating truly miniaturized coils for wireless charging applications
3Manufacturing precision
If laser is used to cut coil patterns through the substrate, then manufacturing precision is improved, but substrate removal difficulty increases
Solution Approach 1:
The laser-transmitting substrate serves as a temporary intermediary that enables precise laser cutting during manufacturing, then can be easily removed after the coil pattern is formed. This intermediary approach solves both the precision cutting requirement and the ease of removal requirement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a low-resistance, thermally efficient, and conductive miniaturized coil suitable for various electronic devices, including wireless charging applications, with controlled dimensions and performance across medium and high frequencies.
Implementation Method 1
transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate
Implementation Method 2
the laser is transmitted through the laser-transmitting substrate and acts on the adhesive layer
Implementation Method 3
cutting a coil pattern on a second side of the metal sheet by means of laser to form a coil running through the two sides of the metal sheet
Data Source
AI summary
Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.