Laser Detachment of Metal Layers on Transparent Substrates
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Solution Overview
Problem
Existing methods for manufacturing electronic components on transparent substrates often rely on inexpensive and technically simple substrates, limiting the use of more complex and expensive materials, and do not allow for the reuse of substrates or flexible component mounting.
Innovation Solution
A method involving a transparent substrate with a laser-meltable or vaporizable metal layer, such as silver, aluminum, or molybdenum, is applied, allowing for the detachment of layers using laser light without damaging the substrate, enabling the reuse of substrates and the production of flexible electronic components that can be mounted on curved surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inexpensive and technically simple substrates are used, then manufacturing costs are reduced, but substrate quality and performance are limited
Solution Approach 1:
The patent implements substrate reuse by detaching the electronic component layer from the substrate using laser irradiation. The substrate is recovered after the metal layer is transferred to the component, allowing expensive substrates like monocrystals or sapphire to be reused multiple times, thereby resolving the contradiction between using high-quality substrates and maintaining cost-effectiveness
Solution Approach 2:
The patent replaces mechanical attachment methods with optical (laser) irradiation to detach the metal layer from the substrate. This substitution enables non-contact, precise detachment that preserves substrate integrity, allowing high-quality substrates to be reused without mechanical damage, thus resolving the contradiction between substrate quality and manufacturing simplicity
2Reliability
If a metal layer is applied to the substrate for component production, then electrical conductivity is improved, but substrate damage during layer detachment occurs
Solution Approach 1:
The patent changes the physical state of the metal layer by irradiating it with laser light at specific wavelengths and energy densities. The laser parameters (wavelength, pulse duration, energy density) are optimized to melt or vaporize the metal layer without transferring excessive heat to the substrate, thus achieving layer detachment while preventing substrate damage and preserving electrical conductivity
Solution Approach 2:
The patent uses ultra-short laser pulses (picosecond to femtosecond duration) to rapidly melt and detach the metal layer before heat can diffuse to the substrate. This rapid process skips the harmful heat diffusion stage, allowing complete layer removal while keeping the substrate intact and undamaged
3Stability of the object's composition
If rigid substrates are used for component production, then manufacturing stability is improved, but flexible component mounting is limited
Solution Approach 1:
The patent segments the electronic component into two parts: the functional layers (metal layer, semiconductor layer, etc.) and the substrate. The functional layers are detached from the rigid substrate and transferred to a flexible carrier film, allowing the component to be mounted on curved or flexible surfaces while maintaining manufacturing stability during the production phase on the rigid substrate
4Reliability
If expensive substrates such as monocrystals or sapphire are used, then component quality is improved, but manufacturing costs increase
Solution Approach 1:
The patent implements a substrate recovery process where expensive substrates like monocrystals or sapphire are reused after the electronic component layers are detached via laser irradiation. The substrate can be prepared for subsequent component production, spreading the high initial cost over multiple production cycles and effectively reducing the per-component manufacturing cost while maintaining high component quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient reuse of complex substrates and the production of flexible electronic components that can withstand mechanical loads, while reducing material costs and enabling the use of expensive substrates, and provides a non-destructive detachment process for thin layers.
Implementation Method 1
a layer that can be melted or vaporized by laser light, preferably a metal layer
Implementation Method 2
a layer that can be melted or vaporized by laser light
Implementation Method 3
the layer that can be melted or vaporized by laser light is detached from the substrate by light from the laser used, which is directed through the substrate onto the layer
Data Source
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AI summary
The present invention relates to a method for producing electronic components on a transparent substrate. The present invention pursues the aim of producing electronic components on substrates without having to rely on inexpensive and therefore technically simple substrates. In order to achieve the object, a substrate is provided which is transmissive to light from a laser used. There is applied to the substrate a layer which is fusible or evaporable by laser light, preferably a metal layer, specifically for example a layer consisting of silver or a layer consisting of aluminum. Further layers required for producing the desired electronic component are applied thereto. After the partial or complete production of the electronic component on the substrate, the layer which is fusible or evaporable by laser light is detached from the substrate, specifically by light from the laser used which is directed through the substrate onto the layer which is fusible or evaporable by laser light, in order thus to separate the layer which is fusible or evaporable by laser light.