Solid-State Layer Separation by Laser Detachment Plane
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Solution Overview
Problem
Conventional methods for thinning semiconductor substrates are inefficient, leading to material loss and potential damage during grinding and polishing, and existing polymer-based methods for separating solid-state layers are slow due to long removal times and adverse effects on adhesion.
Innovation Solution
A method involving laser modification of the solid-state body to create a detachment plane, followed by the introduction of external stresses for crack propagation, allowing for the separation of solid-state layers without material removal processes, and the use of a metal layer for stress compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional grinding and polishing methods are used to thin substrates, then the final desired substrate thickness is achieved, but valuable material is lost and components may be damaged
Solution Approach 1:
The patent applies preliminary action by creating laser-induced modifications and a detachment plane within the solid-state body before the actual separation process. This pre-prepared structure enables clean separation without requiring subsequent grinding or polishing, thereby preventing material loss while achieving the desired thickness precision.
Solution Approach 2:
The patent replaces the mechanical grinding and polishing system with a laser-based modification system. By using laser beams to create modifications and induce detachment, the process eliminates the need for contact-based mechanical removal that causes material loss and potential damage to components.
2Loss of substance
If polymer layers are used for separating solid-state layers, then material loss is reduced, but the removal process takes several hours limiting industrial utilization
Solution Approach 1:
The patent extracts the polymer layer after it has served its purpose of enabling clean separation. By removing the polymer layer completely after separation, the process eliminates the time-consuming step of waiting for polymer decomposition while maintaining the benefit of reduced material loss during separation.
Solution Approach 2:
The patent changes the state or properties of the polymer layer by removing it entirely after use, rather than waiting for slow chemical decomposition. This parameter change from 'in-situ decomposition' to 'extraction and removal' dramatically reduces the time required while maintaining the separation quality.
3Adaptability or versatility
If fillers are added to polymer to influence thermal expansion or elasticity, then local influence is achieved, but adhesion of polymer to solid-state body surface worsens
Solution Approach 1:
The patent uses a disposable polymer layer that serves its function temporarily during the separation process. The polymer is applied, enables the separation through stress generation, and then completely removed. This approach eliminates the need for fillers that would compromise adhesion, as the polymer's temporary use allows it to be optimized for stress generation rather than long-term adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of planar solid-state layers with reduced material loss and wear, facilitating the creation of electrical components with lower material and processing costs, and allows for precise control of surface roughness and stress compensation.
Implementation Method 1
Generating a variety of modifications by means of laser beams within the solid-state body to form a detachment plane
Implementation Method 2
the modifications generate compressive stresses in the solid-state body
Implementation Method 3
the stresses bring about crack propagation along the detachment plane
Implementation Method 4
for at least partial compensation of a deformation of the solid-state layer brought about by the compressive stresses on the remaining modification constituents
Data Source
AI summary
The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.