Laser-Created Detachment Regions for Precise Solid Layer Separation
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Solution Overview
Problem
Conventional methods for separating solid components, such as sawing, result in material waste, surface damage, and high costs due to the production of chips and thickness fluctuations, while laser-based methods face challenges with thermal stress and precision in creating crystal lattice modifications.
Innovation Solution
A method using LASER radiation to create detachment regions in solids by penetrating through a surface of the solid body, inducing material transformations and crystal lattice modifications without local destruction, allowing for controlled weakening and precise separation of solid layers without shortening the solid orthogonally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If sawing is used to separate solid components, then separation is achieved, but material waste increases due to chip production and surface damage occurs
Solution Approach 1:
The patent replaces the mechanical sawing system with a laser-based system that uses optical energy to induce material transformations. The laser creates detachment regions through controlled heating and phase changes, eliminating mechanical contact that causes chips and surface damage, thus resolving the contradiction between material loss and surface quality
Solution Approach 2:
The patent utilizes phase transitions of materials (melting, vaporization, or other phase changes) induced by laser heating to create detachment regions. By controlling the thermal energy input, the laser causes localized phase transitions that weaken the material structure without mechanical contact, reducing both material waste and surface damage compared to sawing
2Loss of substance
If laser radiation is used to create detachment regions, then material loss is reduced, but thermal stress and distortion increase
Solution Approach 1:
The patent applies laser radiation with highly localized energy deposition to create detachment regions only in specific areas where separation is needed. By concentrating thermal energy in localized zones rather than heating the entire workpiece, the method reduces overall thermal stress and distortion while still achieving effective separation with minimal material loss
Solution Approach 2:
The patent employs pulsed laser radiation rather than continuous heating. The periodic application of thermal energy allows heat dissipation between pulses, preventing excessive temperature buildup and reducing thermal stress and distortion while maintaining the ability to create precise detachment regions with minimal material loss
3Manufacturing precision
If laser beams penetrate through the entire solid body, then separation is achieved, but processing time increases and thermal damage expands
Solution Approach 1:
The patent applies laser radiation only to the extent necessary to create detachment regions for separation, rather than penetrating through the entire solid body. By applying partial action localized to the separation interface, the method achieves precise separation while minimizing processing time and limiting thermal damage to the necessary minimum area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise separation of solid layers with reduced material loss and surface damage, lowering costs and thermal stress, and allows for processing of thicker solids by controlling the LASER exposure and crystal lattice modifications.
Implementation Method 1
exposing the solid body to laser radiation from the laser light source, wherein the laser beams penetrate into the solid body via a surface of the solid body portion to be separated, wherein the laser radiation applies defined radiation to a predetermined portion of the solid body inside the solid body to form a detachment region
Implementation Method 2
the temperature generated in the predetermined portion of the solid body is so high that the material forming the predetermined portion undergoes modifications in the form of a predetermined material transformation
Implementation Method 3
several modifications are successively produced in the crystal lattice by the laser exposure, wherein the crystal lattice tears as a result of the modifications in the regions surrounding the modifications
Implementation Method 4
the laser radiation applies defined radiation to a predetermined portion of the solid body inside the solid body to form a detachment region or several partial detachment regions
Data Source
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AI summary
The present invention relates to a method for generating a detachable area (2) in a solid (1) for detaching a solid component (12), in particular a solid layer (12), from the solid (1), wherein the solid component (12) to be detached is thinner than the solid after the solid component (12) has been reduced. According to the invention, the method comprises at least the following steps: providing a solid (1) to be processed, wherein the solid (1) preferably consists of a chemical compound; providing a laser light source;The laser beams penetrate the solid (1) via a surface (5) of the solid portion (12) to be separated, the laser beams defining a predetermined portion of the solid (1) within the solid (1) to form a detachment area (2) or several partial detachment areas (25, 27, 28, 29), characterized in that the laser beams successively generate several modifications (9) in the crystal lattice, the crystal lattice cracking in at least a portion of the regions surrounding the modifications (9) as a result of the modifications (9), the detachment area (2) or several partial detachment areas (25, 27, 28, 29) being defined by the cracks in the region of the modifications (9).