Laser Detecting Unit for Precise Substrate Etching Control
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Solution Overview
Problem
Current methods for precise etching in semiconductor manufacturing face challenges due to inaccurate measurement of light profile and power, leading to deviations in critical dimensions of monitoring and anchor patterns, which affects the precision and uniformity of the etching process.
Innovation Solution
A detecting unit with a housing containing a profile measuring member and a power measuring member, along with a light splitting member, is used to accurately measure the focal distribution and power of laser light, minimizing interference from refracted or scattered light, and ensuring precise etching by controlling the light characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light characteristics are not accurately measured, then etching process cannot be precisely controlled, but installing complex measurement equipment increases device complexity
Solution Approach 1:
The measurement system is designed to perform multiple functions using a single integrated setup. The beam splitter configuration allows simultaneous measurement of both light profile and absolute power, while the home port serves as both a positioning reference and a measurement location. This multi-functional approach achieves precise etching control without requiring separate complex measurement systems for each parameter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise etching on substrates by accurately measuring and controlling light characteristics, improving the precision and uniformity of the etching process, thereby correcting critical dimension deviations and enhancing measurement accuracy.
Implementation Method 1
a light splitting member for splitting the laser light incident from an upper portion of the housing to the profile measuring member and the power measuring member
Data Source
AI summary
The present invention provides a substrate treating apparatus including: support unit is configured to support and rotate a substrate in a treatment space; a liquid supply unit is configured to supply a liquid to the substrate supported by the support unit; a laser unit including a laser irradiation unit which irradiates laser light to the substrate supported by the support unit; a home port providing a standby position in which the laser unit waits; and a moving unit for moving the laser unit between a process position in which the laser light is irradiated to the substrate and the standby position, in which the home port detects a characteristic of the laser light from the laser light irradiated by the laser unit.