Laser Reformed Pattern Dicing for Crack-Free Semiconductor Chips
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Solution Overview
Problem
The existing substrate dicing methods often result in dicing crack failures due to irregularly formed reformed patterns, which can damage active regions and hinder the efficient separation of semiconductor chips.
Innovation Solution
A substrate dicing method involving the formation of reformed patterns using a laser beam, specifically employing a combination of center and edge focused beams generated by axicon lenses, to create uniformly spaced or contacting patterns that facilitate the separation of semiconductor chips without inducing dicing cracks, followed by grinding and expansion to achieve precise chip division.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laser dicing methods are used to separate substrate into chips, then chip separation is achieved, but dicing crack failures occur due to irregularly formed reformed patterns
Solution Approach 1:
The method performs preliminary actions by forming reformed patterns in the substrate before the actual dicing separation. These pre-formed patterns serve as controlled weak points that guide the separation process, preventing random crack propagation during chip division and thereby reducing dicing crack failures while maintaining efficient chip separation
Solution Approach 2:
The invention changes the physical parameters of the substrate by creating reformed patterns with specific structural characteristics. By controlling the formation of these patterns through laser processing, the substrate's mechanical properties are locally modified to enable clean separation along predetermined paths, improving both separation efficiency and reliability
2Ease of manufacture
If reformed patterns are formed irregularly in the substrate, then dicing process is simplified, but active regions are damaged and chip separation is hindered
Solution Approach 1:
The method applies local quality by forming reformed patterns with specific uniform characteristics in the scribe lane regions while leaving the active regions untouched. This localized treatment ensures that the simplification of the dicing process does not compromise the integrity of active regions, achieving both ease of manufacture and manufacturing precision
Solution Approach 2:
The invention replaces mechanical dicing methods with a laser-based approach that forms reformed patterns through optical energy. This substitution allows for more precise control over pattern formation, achieving uniform reformed patterns that facilitate simple dicing processes without damaging active regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively limits and prevents dicing crack failures, ensuring the integrity of active regions and enabling the precise separation of semiconductor chips, thereby enhancing the semiconductor device fabrication process.
Implementation Method 1
forming reformed patterns in a substrate using a laser beam
Implementation Method 2
employing a combination of center and edge focused beams generated by axicon lenses
Data Source
AI summary
According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.