Laser Dicing Energy Control for Precise Semiconductor Trenches
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Solution Overview
Problem
Current laser dicing methods for semiconductor structures face challenges in efficiently forming precise trenches without damaging seal rings or varying material categories, leading to inconsistent dicing results and reduced packaging yield.
Innovation Solution
A laser dicing system comprising a host device and a laser source that reads and adjusts dicing laser energy based on information embedded in marks on the semiconductor structure, allowing for tailored trench formation across different material categories and depths, ensuring consistent and precise cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fixed laser energy is used for dicing, then the device complexity is reduced, but the manufacturing precision deteriorates due to varying material categories
Solution Approach 1:
The system performs preliminary scanning to detect material categories and embeds this information in marks before the actual dicing operation. This preliminary detection allows the laser energy to be pre-adjusted for each material category, ensuring precise trench formation without requiring complex real-time adjustments during dicing.
Solution Approach 2:
The laser energy is made dynamic and adjustable based on the detected material category. The system transitions from fixed laser energy to variable laser energy control, where the energy level is adapted to match the specific material being diced, thereby improving precision while maintaining manageable system complexity through automated control.
2Manufacturing precision
If high laser energy is used to ensure consistent trench formation, then the manufacturing precision is improved, but the object-affected harmful factors increase due to potential damage to seal rings
Solution Approach 1:
The system applies different laser energy levels to different material categories locally. By identifying the material category through mark detection and adjusting the laser energy accordingly, the system delivers the precise amount of energy needed for each material type, ensuring consistent trench formation while avoiding excessive energy that could damage sensitive components like seal rings.
Solution Approach 2:
The laser energy parameter is dynamically changed based on the detected material category. The system modifies the laser energy parameter to match the specific requirements of each material, achieving consistent trench formation across varying materials while preventing harmful effects from excessive energy application.
3Manufacturing precision
If material detection and energy adjustment are implemented, then the manufacturing precision is improved, but the productivity is reduced due to additional scanning and processing steps
Solution Approach 1:
The material detection and mark reading are performed as preliminary actions before the main dicing operation. By detecting material categories and preparing the laser energy settings in advance, the system minimizes interruptions during the actual dicing process, thereby reducing the impact on overall productivity while still achieving improved precision.
Solution Approach 2:
The system maintains continuous operation by integrating the detection and energy adjustment processes into the overall dicing workflow. The preliminary scanning and mark reading are performed efficiently, and the laser dicing continues without significant interruptions, preserving productivity while achieving consistent trench formation across different materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances the precision and reliability of laser dicing by adjusting laser energy according to material categories, reducing chip collapse and improving packaging yield by ensuring consistent trench formation across varying materials.
Implementation Method 1
The laser source is coupled to the host device and is configured to generate a dicing laser energy to form a trench on the semiconductor structure
Data Source
AI summary
A laser dicing system is disclosed. The laser dicing system includes a host device and a laser source. The host device reads and identifies a mark formed on a surface of a semiconductor structure. The laser source is coupled to the host device and is configured to generate a dicing laser energy to form a trench on the semiconductor structure. The dicing laser energy irradiated on the semiconductor structure is adjustable based on information embedded in the mark.