Laser Dicing Light-Emitting Devices With Stepped Cutting Regions
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Solution Overview
Problem
Conventional laser-dicing methods for light-emitting devices result in increased light-blocking areas on the side-walls of separated devices, reducing light extraction efficiency.
Innovation Solution
A method involving the use of a laser to form cutting regions with specific dimensions and patterns on a light-emitting wafer, such as a wave-like or ladder-type pattern, which reduces the depth and width of cutting regions, thereby minimizing the light-blocking area and enhancing light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laser-dicing methods are used to separate light-emitting devices, then the devices can be efficiently separated, but the light-blocking area on the side-walls increases, reducing light extraction efficiency
Solution Approach 1:
The cutting structure is divided into multiple stepped levels rather than a single continuous cut. The laser beam creates a multi-level cutting structure with horizontal surfaces at different heights, segmenting the原本 continuous cutting path into discrete steps that reduce the total side-wall area blocking light extraction.
Solution Approach 2:
The cutting structure extends into the vertical dimension with multiple levels at different heights. By creating horizontal surfaces at different vertical positions, the solution adds dimensional complexity that reduces the effective light-blocking area compared to a simple planar cut.
2Manufacturing precision
If the laser beam intensity is increased to improve cutting precision, then the cutting depth and width can be better controlled, but the risk of damaging the light-emitting wafer increases
Solution Approach 1:
The laser beam is applied in periodic pulses rather than continuous irradiation. The laser writing process uses periodic scanning along scribing streets with controlled pulse intervals, allowing heat dissipation between pulses and preventing excessive thermal accumulation that could damage the wafer while maintaining precise cutting control.
Solution Approach 2:
The laser parameters (intensity, scanning speed, pulse duration) are optimized to achieve the desired cutting dimensions. By carefully controlling the laser writing parameters, the process achieves precise cutting depth and width control without exceeding the threshold that would cause wafer damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases light extraction efficiency by at least 2% compared to conventional laser-dicing methods, with reduced light-blocking areas on the side surfaces of the separated light-emitting devices.
Implementation Method 1
irradiating a laser beam to form a plurality of cutting regions along the scribing streets
Data Source
AI summary
A method for manufacturing a light-emitting device includes steps of: providing a light-emitting wafer including an upper surface and a lower surface opposite to the upper surface; setting a plurality of scribing streets on the upper surface of the light-emitting wafer; irradiating a laser beam to form a plurality of cutting regions along the scribing streets, wherein each of the plurality of cutting regions has a sharp end, or the plurality of cutting regions forms a specific pattern in a cross-sectional view; and forming a plurality of light-emitting devices by connecting the plurality of cutting regions and extending the plurality of cutting regions from the respective sharp ends thereof to the lower surface of the light-emitting wafer.