Laser-Modulated Substrate Dicing Without Reforming Regions
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Solution Overview
Problem
Existing substrate dicing technologies face challenges in accurately cutting semiconductor wafers without forming reforming regions, which can lead to inefficiencies and potential damage to the substrate surfaces.
Innovation Solution
An apparatus for substrate dicing that includes a laser beam emitter, a stage with a test substrate, a laser beam modulator, an optical system, a camera, and a controller. The apparatus modulates the laser beam based on control signals generated from image data captured by the camera, ensuring that the laser power does not form reforming regions in the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high power laser beam is used to cut the wafer, then cutting speed is improved, but reforming regions are formed in the substrate causing damage
Solution Approach 1:
The laser beam is applied in periodic pulses rather than continuous exposure. The controller regulates the laser beam emitter to output beams at specific intervals, allowing the substrate to cool between pulses and preventing reforming region formation while maintaining cutting speed
Solution Approach 2:
The laser beam parameters (power, pulse duration, frequency) are dynamically adjusted based on real-time feedback from the camera system. The controller modifies these parameters to maintain optimal cutting conditions without exceeding the threshold that causes substrate damage
2Productivity
If laser beam power is increased to improve dicing efficiency, then productivity is improved, but substrate surface damage occurs
Solution Approach 1:
A camera system captures images of the wafer during the dicing process, and the controller uses this visual feedback to monitor the cutting progress and substrate condition. Based on this feedback, the controller adjusts the laser beam power in real-time to maintain high productivity while preventing substrate surface damage
Solution Approach 2:
The laser beam power is made dynamic rather than static. The controller continuously adjusts the power level during the dicing process based on real-time conditions, allowing the system to operate at high efficiency when appropriate while automatically reducing power to prevent damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables precise cutting of semiconductor substrates without forming reforming regions, allowing for efficient dicing while preventing damage to the substrate surfaces, thus improving the accuracy and reliability of the dicing process.
Implementation Method 1
a laser beam emitter configured to output a laser beam
Implementation Method 2
a stealth dicing method that focuses a laser beam into the wafer
Implementation Method 3
the test film includes a material for absorbing the modulated beam
Data Source
AI summary
An apparatus for substrate dicing includes: a laser beam emitter outputting a laser beam; a stage on which a test substrate is loaded, wherein the test substrate includes a sample substrate and a test film; a laser beam modulator modulating the laser beam to output a modulated beam; an optical system transferring the modulated beam into the sample substrate; a camera capturing the modulated beam that is reflected from the test film; and a controller generating a control signal based on at least one of a reaction point being formed in the test film or a shape of the reaction point of the test film being biased toward one side with respect to a central axis, wherein the laser beam modulator is configured to modulate the laser beam based on the control signal to output the modulated beam.