Laser Diode Array Electric Cross Talk Inhibition via Peel Layer Oxidation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In laser diode arrays, as the distance between adjacent laser diodes decreases, significant heat-generated cross talk and current leakage lead to interference and color blur, making it difficult to separate laser diodes electrically and inhibit electric cross talk.
Innovation Solution
A method involving the formation of a peel layer with an oxidizable material and a vertical resonator structure on a substrate, followed by oxidation and peeling to create columnar shapes that are then jointed to a metal layer, separating the resistance component of the substrate from each laser diode, thereby inhibiting electric cross talk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between adjacent laser diodes is reduced to achieve downsizing, then the integration density increases, but heat-generated cross talk and current leakage become significant causing interference and color blur
Solution Approach 1:
The invention divides the common substrate's resistance component into separate resistance components for each laser diode by providing individual grooves and terminal sections. This segmentation isolates the electrical paths, preventing current leakage between adjacent laser diodes while maintaining high integration density.
Solution Approach 2:
The invention extracts the harmful common resistance component from the shared substrate and relocates it to individual terminal sections at the ends of grooves. This extraction removes the source of electric cross talk while preserving the compact array structure.
2Temperature
If grooves are provided between each laser diode to conduct heat away, then thermal cross talk is decreased, but it is difficult to increase the width and depth of the groove to totally separate laser diodes electrically
Solution Approach 1:
The invention introduces terminal sections as intermediary elements at the ends of grooves. These terminal sections serve as dedicated electrical connection points that mediate between the laser diodes and the external circuit, providing complete electrical isolation while maintaining thermal management through the groove structure.
Solution Approach 2:
The invention extends the groove structure into a third dimension by adding terminal sections at the ends, transforming the simple linear groove into a three-dimensional electrical isolation structure. This dimensional extension enables complete electrical separation that cannot be achieved by groove width and depth alone.
3Ease of manufacture
If a common substrate is used for forming each vertical resonator structure, then manufacturing is simplified, but the resistance component of the common substrate connected in series to each vertical resonator structure causes electric cross talk
Solution Approach 1:
The invention segments the electrical connection path by providing individual terminal sections for each laser diode at the ends of grooves. This segmentation maintains the simplicity of using a common substrate for manufacturing while eliminating the electric cross talk caused by the common substrate's resistance component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively separates the resistance component of the common substrate from each laser diode, preventing electric cross talk and maintaining the performance of the laser diode array in optical communication devices and printers.
Implementation Method 1
a peeling step of oxidizing the peel layer from a side face, and then peeling the vertical resonator structure of columnar shape from the first substrate
Data Source
AI summary
A method of manufacturing a laser diode array capable of inhibiting electric cross talk is provided. The method of manufacturing a laser diode array includes a processing step of forming a peel layer containing an oxidizable material and a vertical resonator structure over a first substrate sequentially from the first substrate side by crystal growth, and then selectively etching the peel layer and the vertical resonator structure to the first substrate, thereby processing into a columnar shape, a peeling step of oxidizing the peel layer from a side face, and then peeling the vertical resonator structure of columnar shape from the first substrate, and a rearrangement step of jointing a plurality of vertical resonator structures of columnar shape obtained by the peeling step to a surface of a metal layer of a second substrate formed with the metal layer on the surface.


