Laser Diode Bar Assembly Grooved Insulating Layer
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Solution Overview
Problem
Existing laser diode array assemblies face challenges in maintaining accurate alignment and minimizing stress due to thermal expansion mismatches, which affects reliability and efficiency, especially when using high-temperature solders in harsh environments.
Innovation Solution
A laser diode bar assembly is created by soldering a metallized insulating layer to a heat sink with parallel grooves, allowing individual streets to move with thermal expansion, reducing stress and enabling the use of high-temperature solders while providing thermal conduction and electrical isolation between diode bars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature solders are used to assemble the diode bar array for harsh environments, then the reliability and temperature resistance are improved, but thermal expansion mismatches cause stress on the bars leading to reliability issues
Solution Approach 1:
The substrate is divided into multiple streets (conductive regions) separated by grooves. This segmentation allows each street to independently accommodate thermal expansion of adjacent diode bars, preventing stress accumulation across the entire array while maintaining high-temperature soldering reliability
Solution Approach 2:
Different regions of the substrate are given different properties: streets are made conductive for electrical connectivity and heat dissipation, while grooves are made non-conductive and compliant to absorb thermal expansion stress locally, allowing the assembly to withstand high-temperature soldering without stress-induced failures
2Ease of manufacture
If diode bars are mounted in grooves on a substrate, then the assembly process is simplified, but the bars tend to tip and roll within the grooves during assembly compromising alignment
Solution Approach 1:
The substrate is designed with flexibility to be bent into an arc during assembly, temporarily widening the grooves to receive diode bars without forcing them. After assembly, the substrate returns to its flat shape, securing the bars in precise alignment without tipping or rolling, thus maintaining both ease of manufacture and manufacturing precision
3Power
If multiple diode bars are mounted on a substrate to provide multiplied power, then the power output is improved, but maintaining good alignment of the bars is necessary to maintain high efficiency and reliability
Solution Approach 1:
The substrate is pre-formed with grooves and streets in precise positions before diode bar assembly. This preliminary preparation ensures that when multiple diode bars are mounted to provide multiplied power, they automatically achieve good alignment for high efficiency and reliability without requiring post-assembly adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable operation and optimized alignment, reducing stress-induced issues and allowing for efficient thermal and electrical conductivity, making the assembly simpler and more economical.
Implementation Method 1
The insulating layer streets provide both thermal conduction as well as electrical isolation between the laser diode bars
Implementation Method 2
The insulating layer streets provide both thermal conduction as well as electrical isolation between the laser diode bars
Implementation Method 3
A laser diode bar assembly is created by soldering a metallized insulating layer to a heat sink
Implementation Method 4
allowing individual streets to move with thermal expansion, reducing stress
Data Source
AI summary
A laser diode array is formed on a heat sink having an insulating layer in which a plurality of grooves is formed through the ceramic layer and to or into the heat sink. A laser diode stack is soldered to the ceramic layer.