Laser Diode Bump Structure for Dual-Path Heat Dissipation
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Solution Overview
Problem
Laser diodes used in high-speed optical communication products generate excessive heat, requiring effective cooling solutions to maintain performance and prevent damage from thermal expansion, while existing designs often compromise cooling efficiency and structural integrity.
Innovation Solution
A laser diode device with a waveguide and a bump structure, where the bump is taller than the waveguide, electrically connects the laser diode to a second submount, forming double heat flows and preventing direct contact between the waveguide and the submount, thereby enhancing cooling and reducing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If laser diode power is increased for high-speed optical communication, then communication speed is improved, but heat generation increases
Solution Approach 1:
The heat dissipation path is segmented into two independent channels: one through the submount via the bump, and another through the heat dissipation layer on the laser diode surface. This segmentation allows heat to be dispersed through multiple pathways simultaneously, improving overall heat dissipation efficiency while maintaining high power operation for high-speed communication.
Solution Approach 2:
The laser diode structure is designed with multi-functionality: the bump serves both as an electrical connection element and a heat dissipation pathway, while the heat dissipation layer provides an additional thermal management function. This multi-functionality allows the system to maintain high communication speeds while effectively managing the increased heat generation.
2Temperature
If cooling efficiency is enhanced, then heat dissipation is improved, but structural integrity may be compromised
Solution Approach 1:
The cooling structure is designed with local quality variations: the bump provides localized heat dissipation at the electrical connection point, while the heat dissipation layer covers specific high-heat-generation areas on the laser diode surface. This localized approach enhances cooling efficiency at critical points without requiring a complete structural redesign that might compromise overall structural integrity.
3Temperature
If bump height is increased to improve heat dissipation, then cooling performance is enhanced, but risk of waveguide damage increases
Solution Approach 1:
The heat dissipation approach is extended to another dimension by adding the heat dissipation layer on the laser diode surface, working in conjunction with the vertical bump structure. This multi-dimensional heat dissipation strategy allows for effective cooling without requiring excessive bump height, thereby protecting the waveguide from potential damage while maintaining superior cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the surface temperature of the laser diode by 28.6% and prevents damage from thermal expansion, improving cooling performance and maintaining the structural integrity of the waveguide.
Implementation Method 1
The bump corresponds to the waveguide and one of two ends of the bump is electrically connected to the second electrode, wherein a height of the bump is substantially higher than a height of the waveguide
Implementation Method 2
The laser diode of the laser diode device is communicatively connected to the lens and the optical fiber through a light source
Data Source
AI summary
An optical transceiver system includes a laser diode device. The laser diode device includes a first submount, a second submount, a laser diode, and a bump. The first submount includes a first electrode. The second submount corresponds to the first submount and includes a second electrode. The laser diode is between the first submount and the second submount, and a side of the laser diode adjacent to the first submount is electrically connected to the first electrode. The laser diode has a waveguide and the waveguide is on a side of the laser diode away from the first submount. The bump corresponds to the waveguide, one of two ends of the bump is electrically connected to the second electrode, and a height of the bump is substantially higher than a height of the waveguide.