Laser Diode Electrode Clamping With a Protective Intermediate Plate
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Solution Overview
Problem
Current laser modules face challenges in precise positioning and adjustment of laser chips, risk of damage to electrodes due to direct clamping, and lack of protection against accidental impacts, with existing solutions either requiring high-precision devices or compromising electrode integrity.
Innovation Solution
A laser connection module with an external structure that houses and protects the electrode and laser diode assembly, using clamping studs and an intermediate protection plate made of harder material to prevent damage, and ensuring secure electrical and thermal contact without compromising the electrodes, along with internal conduits for cooling fluid circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding is used to join laser chips to electrodes, then secure electrical and thermal contact is achieved, but the laser chip must be positioned with extreme precision (8-10 microns) and cannot be adjusted or replaced later
Solution Approach 1:
The invention separates the joining function from the positioning function. The laser chip is first positioned with less precision using a simple mechanical support structure, then a separate bonding process (soldering or conductive adhesive) secures the electrical and thermal contact. This segmentation allows positioning and bonding to be optimized independently, eliminating the need for extreme positioning precision while maintaining reliable contact.
Solution Approach 2:
The invention introduces an intermediary bonding layer (solder or conductive adhesive) between the laser chip and electrode. This intermediary material compensates for dimensional tolerances and expansion coefficient differences, allowing less precise positioning while still achieving secure electrical and thermal contact. The bonding layer acts as a buffer that absorbs positioning errors.
2Ease of manufacture
If direct clamping is used to secure electrodes and laser chips, then assembly is simplified, but the electrodes are at risk of damage from screw heads and nuts acting directly on them
Solution Approach 1:
The invention introduces an intermediate protection plate made of harder material positioned between the clamping screws/nuts and the electrode. This protection plate acts as a mediator that transfers the clamping force without directly contacting the soft electrode material, preventing damage while maintaining assembly simplicity. The harder intermediate plate distributes the localized clamping stress.
Solution Approach 2:
The protection plate is installed beforehand on the electrode surface before applying the clamping force. This prior cushioning prevents direct contact between the hard clamping elements and the soft electrode, protecting the electrode from damage during the assembly process while maintaining simple clamping construction.
3Stability of the object's composition
If different expansion coefficients between laser chip and electrode materials are accommodated, then chip bending is prevented, but the clamping force distribution becomes complex
Solution Approach 1:
The invention changes the material parameters of the protection plate, selecting a material with hardness greater than the electrode material. This parameter change allows the protection plate to withstand the clamping force without deforming, while its intermediate position allows it to accommodate the expansion coefficient differences between the laser chip and electrode. The protection plate's mechanical properties are optimized to handle both the clamping force and thermal expansion variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides secure, adjustable, and protected electrical and thermal connections for laser diodes, preventing damage to electrodes and allowing for easy replacement, while maintaining efficient heat dissipation and precise alignment.
Implementation Method 1
internal conduits for the circulation of a cooling fluid
Implementation Method 2
ensure their contact with the laser chips positioned between them, ensuring the electrical power supply to said laser chips and the dissipation of the heat generated
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
Laser connection module, comprising: - several superimposed electrodes (2), connected in an alternating order with opposite electrical power supply poles; at least one laser diode (4) mounted between the facing surfaces of consecutive electrodes (2), making contact with them; - an external structure (5) delimiting a space defined by a light emission zone of the laser diodes (4) and suitable for housing the assembly of electrodes (2) and laser diodes (4), superimposed, - a clamping means (6) mounted on a first end of the external structure (5), and which presses the assembly of electrodes (2) and laser diodes (4) against a second opposite end of said structure (5), establishing their fastening and mutual contact and, - an intermediate plate (50) of protection arranged between the clamping means (6) and the end electrode (2) closest to said clamping means (6).