Laser Diode Assembly With Integrated Cooling and Collimation
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Solution Overview
Problem
Existing tunable laser diode systems generate significant waste heat and require bulky active liquid cooling systems, which are heavy and lack integrated temperature control and collimation functionality.
Innovation Solution
A compact heat sink system with fins and a flange structure for heat dissipation, integrated with a collimating optic, and a thermoelectric cooler for precise temperature control, allowing for lightweight and efficient heat management and wavelength tuning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active liquid cooling systems are used to dissipate heat from laser diode systems, then heat dissipation effectiveness is improved, but system weight and bulk increase significantly
Solution Approach 1:
The patent replaces the mechanical liquid cooling system with a passive thermoelectric cooler (TEC) that uses electrical current to achieve cooling. This substitution eliminates the need for pumps, fluids, and complex mechanical components, thereby significantly reducing system weight and bulk while maintaining effective heat dissipation from the laser diode.
Solution Approach 2:
The patent integrates the thermoelectric cooler, heat sink, and collimating optic into a single unified assembly. This merging of previously separate components (cooling system and optical system) into one compact unit reduces overall system bulk and weight while maintaining both cooling effectiveness and collimation functionality.
2Adaptability or versatility
If separate sub-assemblies are used for temperature control and collimation, then functional independence is improved, but device complexity increases
Solution Approach 1:
The patent combines the temperature control function (thermoelectric cooler) and the collimation function (optical system) into a single integrated assembly. This merging reduces the number of separate sub-assemblies and interfaces, thereby simplifying the overall device structure and reducing complexity while maintaining both functions within the unified design.
Solution Approach 2:
The integrated assembly serves multiple functions simultaneously: the thermoelectric cooler provides temperature control while the same assembly houses the collimating optic for beam collimation. This multi-functionality approach allows the system to perform both temperature regulation and optical collimation through a single unified structure, reducing complexity compared to separate dedicated sub-assemblies.
3Measurement precision
If precise temperature control is implemented to maintain wavelength accuracy, then wavelength precision is improved, but system complexity increases due to additional control components
Solution Approach 1:
The patent implements a feedback control system where a temperature sensor monitors the laser diode temperature and feeds this information to a controller that adjusts the thermoelectric cooler current accordingly. This feedback mechanism maintains precise temperature control (within 0.1°C of setpoint) to ensure wavelength accuracy while using a relatively simple control architecture that does not significantly increase system complexity.
Solution Approach 2:
The thermoelectric cooler system is designed to self-regulate temperature through integrated feedback control, automatically maintaining the laser diode at the desired temperature without requiring external intervention. The system monitors its own temperature state and adjusts cooling power accordingly, providing self-service temperature control that maintains wavelength precision without adding substantial complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains laser diode temperature within 0.1°C of the setpoint, facilitating precise wavelength tuning and collimation while reducing system bulk and weight.
Implementation Method 1
The plurality of fins facilitates in dissipating heat generated by the laser diode
Implementation Method 2
The plurality of fins facilitates in dissipating heat generated by the laser diode
Implementation Method 3
a second cylindrical portion extending axially from the first cylindrical portion that houses a collimating optic to generate a laser beam
Implementation Method 4
A compact heat sink system with fins and a flange structure for heat dissipation, integrated with a collimating optic, and a thermoelectric cooler for precise temperature control
Data Source
AI summary
Systems, devices, and methods for a laser diode assembly including: a laser diode configured to emit a laser beam; and a housing configured to receive at least a portion of the laser diode, where the housing includes: a first cylindrical portion defining a first chamber, where the laser diode is at least partially disposed in the first chamber; and a flange structure connected to the first cylindrical portion, where the flange structure comprises a base extending radially outwardly from the first cylindrical portion and a plurality of fins arranged linearly along the base and extending outwardly from the base, where the plurality of fins facilitates in dissipating a heat generated by the laser diode.