Laser Diode Multi-Surface Cooling Design

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Solution Overview

Problem

Semiconductor-based laser chips face challenges in efficiently dissipating waste heat, limiting their optical output power due to thermal resistance and the risk of overheating.

Innovation Solution

The laser component design includes a laser chip with multiple heat dissipation surfaces (top side, underside, and side surfaces) thermally connected to a heat sink, along with hermetic encapsulation and electrical contact pads for efficient heat and electrical connectivity, using electrically insulating materials like aluminum nitride for effective thermal conductivity without electrical shorts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If laser chips are arranged on carriers with good thermal conductivity, then heat dissipation is improved, but the optical output power is limited due to thermal resistance and overheating risk

Engineering Contradiction:

Improveheat dissipationVSAvoidoptical output power

Core Design Contradiction:

TemperatureVSPower

Solution Approach 1:

The patent transitions from conventional single-point or single-surface heat dissipation to multi-dimensional heat dissipation by thermally coupling all six surfaces of the laser chip (top, bottom, and four side surfaces) to heat sinks. This dimensional expansion of heat dissipation pathways dramatically reduces thermal resistance and enables higher optical output power without overheating.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation system is segmented into multiple independent heat sinks, each coupled to a specific surface of the laser chip. This segmentation allows optimized thermal management for each surface and enables parallel heat dissipation channels, improving overall thermal efficiency and supporting higher power operation.

Inventive Principle:

Principle #1Segmentation

2Temperature

If multiple heat dissipation paths are implemented, then thermal management is improved, but device complexity increases

Engineering Contradiction:

Improvethermal managementVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Multiple heat sinks are merged into a single integrated heat dissipation assembly that simultaneously contacts multiple surfaces of the laser chip. This merging approach maintains effective multi-dimensional heat dissipation while reducing the number of separate components and simplifying the overall device structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat sink assembly serves multiple functions simultaneously: it provides thermal coupling to multiple chip surfaces, offers mechanical support for the laser chip, and enables electrical isolation between chip surfaces. This multi-functionality reduces the need for additional separate components, thereby reducing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If hermetic encapsulation is used, then reliability is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvehermetic sealingVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The hermetic encapsulation structure is designed as a nested assembly where the laser chip is positioned within a sealed housing that integrates with the heat sink assembly. This nested configuration provides reliable hermetic sealing while using a modular approach that simplifies manufacturing compared to monolithic sealed structures.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables high optical output power operation while preventing overheating, with effective heat dissipation through multiple surfaces and electrical insulation, extending the component's lifespan and reliability.

Implementation Method 1

the first side surface of the laser chip thermally conductively connects to a heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

using electrically insulating materials like aluminum nitride for effective thermal conductivity without electrical shorts

Methodology Applied

Scientific EffectThermal insulation with electrical conductivity: Conduction (thermal)

Data Source

PatentUS9559491B2Laser diode with cooling along even the side surfaces

Publication Date: 2017.01.31 OSRAM OLED

AI summary

A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink.