Laser Diode Assembly Layout for Dense Packing and Heat Dissipation
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Solution Overview
Problem
Current laser diode arrays are limited by bulky and expansive heatsink designs, electrical connections, and mounting features, which restrict the density and power of laser diode arrays, thereby limiting the output beam's power, shape, and intensity.
Innovation Solution
A compact laser diode apparatus design featuring a heatsink that extends perpendicularly from the emission surface, with positive and negative electrical terminal blocks and electrical foils that are electrically isolated from the heatsink, maintaining a cross-sectional footprint not larger than 120% of the laser diode array, allowing for closer packing and increased density without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heatsink designs are used, then heat dissipation is achieved, but the device becomes bulky and expansive
Solution Approach 1:
The heatsink extends perpendicularly away from the emission surface in the vertical dimension, allowing heat dissipation functionality to be achieved without increasing the horizontal cross-sectional footprint. This dimensional transition enables compact lateral dimensions while maintaining effective thermal management through vertical heat sinking structures.
2Power
If multiple laser diode arrays are arranged in close packed configuration, then output power is scaled, but device complexity increases
Solution Approach 1:
The laser diode array is divided into multiple individual laser diode bars with separate emitters, each capable of independent operation. This segmentation allows the arrays to be closely packed while maintaining manageable electrical and thermal connections for each segment, reducing overall system complexity compared to treating the entire array as a single unit.
Solution Approach 2:
The heatsink structure serves multiple functions simultaneously: it provides thermal management for the laser diode array, acts as a mechanical support structure, and enables close packing of multiple arrays. This multi-functionality reduces the need for separate components, thereby reducing device complexity.
3Power
If electrical connections and mounting features are included, then electrical functionality is achieved, but the device becomes larger
Solution Approach 1:
The electrical terminal blocks are integrated directly with the heatsink structure, merging the electrical connection function with the thermal management structure. This integration eliminates the need for separate electrical mounting features, reducing the overall cross-sectional footprint while maintaining both electrical and thermal functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a higher density of laser diode arrays in a laser assembly, enhancing the power, shape, and intensity of the output beam while maintaining efficient heat dissipation and electrical isolation.
Implementation Method 1
A heatsink is in thermal communication with the laser diode array at the mounting surface
Implementation Method 2
Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals
Data Source
AI summary
A laser diode apparatus includes a laser diode array having an emission surface and a mounting surface. A heatsink is in thermal communication with the laser diode array at the mounting surface. The heatsink extends perpendicularly away from at least one edge of the emission surface. Positive and negative electrical terminal blocks are in mechanical communication with the heatsink opposite the laser diode array. Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals. The electrical foils extend perpendicularly away from the emission surface. The positive and negative electrical terminal blocks are electrically isolated from the heatsink. A cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, and electrical foils is not larger than 120% of a cross-sectional footprint of the laser diode array.