Series Laser Diode Packaging With Double-Sided Cooling
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Solution Overview
Problem
High-powered semiconductor laser diodes face limitations in output power due to heat dissipation issues, leading to increased temperature and reduced reliability, and integrating multiple diodes for higher power output complicates efficient packaging and cooling.
Innovation Solution
A laser diode assembly featuring a heat sink with multiple laser diode units electrically connected in series, utilizing submounts for thermomechanical stress management and double-sided cooling, along with a micro-optical system for beam combination and shaping, to enhance output power and reliability while minimizing auxiliary components and connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple laser diodes are integrated on a platform to achieve higher power output, then the power output is improved, but the packaging complexity and cooling requirements increase
Solution Approach 1:
The platform is divided into multiple independently mountable laser diode units, each with its own submount and cooling contact. This segmentation allows each unit to be packaged and cooled separately, reducing the overall packaging complexity while enabling higher total power output through parallel operation of multiple units.
Solution Approach 2:
Laser diode units are arranged in a two-dimensional array on the platform surface, utilizing both horizontal spacing and vertical stacking dimensions. This spatial arrangement allows multiple diodes to be integrated without excessive thermal interference, managing heat dissipation effectively while achieving higher power output.
2Power
If multiple laser diodes are integrated on a platform to achieve higher power output, then the power output is improved, but the cooling requirements become more stringent
Solution Approach 1:
Each laser diode unit is equipped with its own dedicated cooling contact on the submount that interfaces with the platform's cooling channels. This segmented cooling approach allows independent thermal management for each diode, preventing heat accumulation and enabling higher power output without excessive temperature rise.
Solution Approach 2:
The platform acts as an intermediary thermal management system, with integrated cooling channels that distribute coolant to multiple laser diode units. This intermediary cooling structure efficiently removes heat from multiple high-power diodes simultaneously, enabling higher total power output while maintaining acceptable operating temperatures.
3Reliability
If laser diodes are cooled to keep junction temperature low, then reliability is improved, but the thermal management complexity increases
Solution Approach 1:
Multiple laser diode units are mounted on a common platform that integrates both mechanical support and thermal management functions. The platform combines structural mounting features with embedded cooling channels, merging support and cooling functions into a single integrated structure that reduces overall thermal management complexity while maintaining low junction temperatures for high reliability.
Solution Approach 2:
The platform is designed as a universal mounting and cooling structure that can accommodate multiple different laser diode units with varying power requirements. The standardized submount and cooling interface design allows the same platform architecture to serve multiple diodes with different thermal loads, simplifying thermal management across diverse high-power laser applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves lower thermal impedance, higher output power, and improved reliability by efficiently packaging and cooling multiple laser diodes, reducing costs and increasing manufacturing yield through compact, high-brightness laser diode modules with optimized thermomechanical stress and beam management.
Implementation Method 1
A laser diode can be mounted to a heat sink, which helps reduce thermal impedance
Implementation Method 2
a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer
Data Source
AI summary
Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.