Laser Diode Grid With Offset Liquid Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-power laser diode systems face challenges in combining beams with minimal étendue due to asymmetric beam profiles and limited cooling capabilities, particularly when densely packing standard laser packages, which leads to inefficiencies in heat dissipation and optical design.
Innovation Solution
A laser diode grid element with collimated beams arranged in a grid structure, utilizing offset liquid cooling channels and extension connectors for efficient cooling and compact design, allowing for close packing of standard packages while maintaining effective heat management and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard laser packages are densely packed to combine maximum number of laser beams, then the number of combined beams is increased, but heat dissipation becomes insufficient
Solution Approach 1:
The patent transitions from planar packing to three-dimensional stacking of laser packages. Multiple layers of laser packages are arranged vertically with cooling channels flowing between layers, enabling dense packing while maintaining heat dissipation pathways in the vertical dimension rather than being constrained to two-dimensional平面布局
Solution Approach 2:
The patent implements liquid cooling channels that flow through and between laser package layers. The hydraulic cooling system removes heat from densely packed lasers by circulating coolant through optimized channel paths that access heat sources in three-dimensional space, solving the heat dissipation problem enabled by dense packing
2Productivity
If laser packages are positioned close together to maximize beam combination, then the system compactness is improved, but electrical connectivity becomes difficult to maintain
Solution Approach 1:
The patent introduces extension connectors as intermediary components that bridge the electrical connection between laser packages and the driver circuit board. These connectors extend through the heat sink structure, providing reliable electrical pathways without requiring direct penetration of cooling surfaces or complex wiring through densely packed packages
Solution Approach 2:
The patent divides the electrical connection system into separate functional segments: extension connectors that provide electrical access, heat sinks that provide thermal management, and driver circuitry that provides control. This segmentation allows each component to be optimized independently while working together in the dense three-dimensional configuration
3Temperature
If cooling channels are added to handle heat from dense laser arrays, then heat dissipation is improved, but the available space for laser packing is reduced
Solution Approach 1:
The patent moves cooling channels from two-dimensional planar arrangements to three-dimensional vertical pathways. Cooling channels are positioned to flow between stacked layers of laser packages, utilizing the vertical dimension to provide adequate cooling capacity without consuming horizontal space that would be needed for laser packing
Solution Approach 2:
The patent merges the structural support function, cooling function, and electrical connection function into an integrated assembly. The heat sink structure simultaneously provides mechanical support for laser packages, contains cooling channels for thermal management, and incorporates extension connectors for electrical connectivity, eliminating the need for separate dedicated cooling space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the combination of a maximum number of laser beams into a predetermined aperture with minimal étendue, providing sufficient cooling and efficient heat management, even at high densities, thus optimizing the performance and efficiency of high-power laser diode systems.
Implementation Method 1
the heat dissipated in the laser is transferred to the cooling plate
Implementation Method 2
liquid cooling channels and extension connectors for efficient cooling
Implementation Method 3
Lasers are typically combined with collimation lenses to change the diverging bundle into a parallel bundle
Implementation Method 4
Diode lasers are semiconductor lasers
Data Source
AI summary
A laser diode grid element comprising laser diodes arranged along a corresponding substantially flat surface; and a collimator for each laser diode for generating collimated light beams substantially perpendicular on the respective substantially flat surface. The laser diodes are comprised in standard packages including a base plate serving as cooling surface of the laser diode, a metal housing arranged on the base plate to protect the laser diode, and at least two driving pins which extend from the laser diode through the base plate and which are used for driving the laser diode within the package. The laser diode grid element includes a heat sink arranged in contact with the base plates, and the at least two driving pins of each laser diode extend at least partially through the heat sink. Also provided are light emitting systems comprising such grid elements, and an optical component for use in such system.