Laser Diode Housing Base Wall Feedthroughs

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Solution Overview

Problem

The manufacturing of housings for electronic components, particularly those with laser diodes, is complex due to difficulties in introducing feedthroughs into the lateral walls, which affects the robustness and temperature stability of the final product.

Innovation Solution

A hermetically sealed housing design with a trough-like basic body featuring a heat sink and feedthroughs made of metal, where pins are embedded in a potting compound and secured using compression glazing, allowing for simplified assembly and enhanced thermal stability by managing thermal expansion differences between materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If feedthroughs are introduced into the lateral wall of the housing, then electrical connection is achieved, but the manufacturing complexity increases and structural robustness decreases

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidfeedthrough introduction complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the base wall: electrical connection feedthroughs, heat sink mounting, and mechanical support are integrated into a single structural element. The base wall serves as both the mounting surface for the heat sink and the pathway for electrical pins, eliminating the need for separate lateral wall feedthroughs and reducing manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Instead of introducing feedthroughs through the lateral wall as in conventional designs, the patent inverts the approach by providing electrical connection through the base wall. The pins extend through the base wall from the bottom side, reversing the traditional feedthrough direction and simplifying the lateral wall structure.

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If feedthroughs are introduced into the lateral wall of the housing, then electrical connection is achieved, but temperature stability and structural robustness deteriorate

Engineering Contradiction:

Improvetemperature stabilityVSAvoidfeedthrough introduction complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The base wall integrates thermal management and electrical connection functions. The heat sink is mounted directly on the base wall, which also provides the pathway for electrical pins, creating a unified structure that maintains thermal stability while achieving electrical connection without compromising the housing's structural integrity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing employs a composite construction where the base wall is made of a material suitable for thermal conduction to support the heat sink, while the lateral walls are made of a different material optimized for structural strength and hermetic sealing. This material differentiation allows the base wall to handle thermal loads without compromising the overall temperature stability of the housing.

Inventive Principle:

Principle #40Composite materials

3Reliability

If pins are embedded in potting compound with compression glazing, then hermetic sealing is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvehermetic sealingVSAvoidassembly simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The pins are pre-positioned and the potting compound is prepared before the final assembly step. The compression glazing process is performed as a preliminary action during the potting compound curing stage, where the glass ring is compressed onto the pins as the compound sets, integrating the hermetic sealing process into the existing assembly flow without requiring separate complex operations.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the production of robust, high-temperature-stable housings for electronic components, such as laser diodes, with simplified manufacturing and reduced mechanical stress, ensuring reliable sealing and efficient heat dissipation.

Implementation Method 1

During cooling of the so glazed feedthrough the through-hole will contract more strongly due to a higher coefficient of thermal expansion of the material of the basic body, and will compress the glass feedthrough

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a base wall of the basic body comprises a heat sink for a thermoelectric cooler

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11367992B2Housing for an electronic component, and laser module

Publication Date: 2022.06.21 SCHOTT AG

AI summary

A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.