Laser Diode Housing with Deflection Element for Thermal Management
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Solution Overview
Problem
Conventional laser diode devices with high optical output power face issues with thermal linking and efficiency due to poor mounting of laser diode chips, leading to decreased optical output power when multiple chips are used, and existing housings are not suitable for high-power chips as they cannot withstand the optical power densities and short wavelengths.
Innovation Solution
A laser diode device design featuring a housing with a cavity, a nitride compound semiconductor laser diode chip, a transmissive covering element, and a deflection element that directs radiation, where the radiation exit area is oriented transversely or perpendicularly to the mounting area, and the covering element tightly seals the housing, allowing for efficient heat dissipation and high optical output power without the need for potting materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional housings are used for high-power laser diode chips, then the housing structure is simple and easy to manufacture, but the housing cannot withstand the optical power densities and short wavelengths, leading to poor thermal linking and decreased efficiency
Solution Approach 1:
The patent employs composite material construction for the housing, combining metallic materials (such as aluminum or aluminum alloys) with ceramic materials. This composite structure provides both the mechanical strength and thermal resistance necessary to withstand high optical power densities and short wavelengths, while maintaining manufacturability through established metallurgical and ceramic joining techniques.
Solution Approach 2:
The patent changes the material parameters of the housing by selecting materials with specific thermal conductivity, melting point, and optical resistance properties. The metallic components provide structural integrity and thermal conduction, while ceramic components provide thermal resistance and stability, collectively enabling the housing to withstand high-power laser operation.
2Power
If multiple laser diode chips are used to increase optical output power, then the total optical output power increases, but thermal linking issues arise due to poor mounting, leading to decreased efficiency
Solution Approach 1:
The patent segments the housing into distinct functional zones: mounting areas for laser diode chips with optimized thermal contact, radiation exit areas for light extraction, and heat dissipation pathways. This segmentation allows each chip to be independently mounted with proper thermal management, preventing thermal interference between multiple chips while maintaining high total optical output power.
Solution Approach 2:
The patent introduces intermediate thermal management structures between the laser diode chips and the housing, such as thermally conductive mounting surfaces or heat sinks. These intermediaries facilitate efficient heat transfer from multiple chips to the housing, preventing thermal accumulation and maintaining high conversion efficiency even when multiple chips operate simultaneously.
3Loss of energy
If the radiation exit area is oriented transversely or perpendicularly to the mounting area, then heat dissipation efficiency improves, but the optical path design becomes more complex
Solution Approach 1:
The patent utilizes three-dimensional spatial arrangement by orienting the radiation exit area transversely or perpendicularly to the mounting area. This dimensional reconfiguration creates separate thermal and optical pathways: heat dissipates through the mounting interface while light exits through a different spatial direction, enabling efficient heat management without compromising optical performance.
Solution Approach 2:
The patent introduces a deflection element as an intermediary optical component to manage the light path. This element redirects the radiation from the transverse or perpendicular exit area to the desired output direction, resolving the apparent complexity by adding a simple optical function that maintains both thermal efficiency and optical performance.
4Reliability
If a covering element is added to tightly seal the housing, then thermal stability and protection improve, but the device complexity increases
Solution Approach 1:
The patent designs the covering element to serve multiple functions simultaneously: it seals the housing to maintain thermal stability, protects internal components from environmental damage, and may incorporate transmissive properties to allow light passage where needed. This multi-functionality justifies the added component by consolidating several protective and thermal management functions into a single element.
Solution Approach 2:
The patent applies the covering element selectively in regions where thermal stability and protection are most critical, while leaving other areas open for heat dissipation or optical access. This localized application optimizes the balance between protection and thermal management, adding complexity only where necessary to achieve the desired performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high optical output power and efficient heat dissipation, enabling multiple laser diode chips to be used without significant thermal linking issues, and the use of metallic and ceramic materials ensures the housing can withstand the radiation, maintaining optical efficiency and thermal stability.
Implementation Method 1
a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element
Implementation Method 2
a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element
Implementation Method 3
at least one covering element which is transmissive, at least in places, to the electromagnetic radiation generated by the laser diode chip during operation
Implementation Method 4
at least one laser diode chip that emits electromagnetic radiation through a radiation exit area during operation
Data Source
AI summary
A laser diode device including a housing having a mounting area in a cavity of the housing, at least one laser diode chip that emits electromagnetic radiation through a radiation exit area during operation, at least one covering element which is transmissive, at least in places, to the electromagnetic radiation generated by the laser diode chip during operation, and a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element, wherein the radiation exit area of the laser diode chip runs substantially transversely or substantially perpendicularly with respect to the mounting area and/or with respect to the covering element, the covering element connects to the housing, and the covering element tightly closes the housing.