Laser Diode Submount Layout for Precise Lens Alignment
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Solution Overview
Problem
Misalignment between a laser diode chip and a lens in a laser light source can cause significant deviation in the orientation of emitted laser light, leading to inefficiencies and potential decreases in output power.
Innovation Solution
A laser light source design that fixes the laser diode chip to a submount with the emission layer closer to the submount than the substrate, utilizing a pair of lens supports and a collimating lens bonded to these supports, where the emission end surface of the chip is positioned outward relative to the submount's edge, reducing misalignment by ensuring precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the laser diode chip is mounted with the substrate closer to the submount, then the mechanical stability is improved, but the alignment precision between the laser diode chip and the lens deteriorates
Solution Approach 1:
The patent inverts the conventional mounting orientation by positioning the emission layer closer to the submount than the substrate. This inversion allows the laser diode chip to be mounted face-down, with the emission end surface extending outward beyond the submount edge. This orientation enables direct alignment with the lens positioned on the submount, improving alignment precision while maintaining mechanical stability through the inverted configuration.
2Volume of moving object
If the emission end surface is positioned inward relative to the submount edge, then the device compactness is improved, but the alignment precision between the laser diode chip and the lens deteriorates
Solution Approach 1:
The patent employs an inverted mounting configuration where the emission end surface extends outward beyond the submount edge rather than being positioned inward. This inversion enables direct alignment with the lens while maintaining compactness through optimized spatial arrangement of the laser diode chip, submount, and lens assembly.
3Reliability
If the lens is positioned closer to the laser diode chip, then the optical performance is improved, but the risk of misalignment increases
Solution Approach 1:
The patent implements preliminary alignment actions by designing the submount with specific structural features that pre-position the lens in precise alignment with the laser diode chip's emission end surface. The lens is bonded to the submount at predetermined locations, ensuring correct positioning before final assembly. This preliminary action reduces misalignment risk while maintaining close proximity for optimal optical performance.
Solution Approach 2:
The submount serves as an intermediary component that mediates the positioning relationship between the laser diode chip and the lens. By bonding the lens to the submount and positioning the laser diode chip relative to the submount, the intermediary structure ensures precise alignment while allowing close proximity for optimal optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes misalignment between the laser diode chip and the lens, maintaining accurate optical axis orientation and reducing the likelihood of output power decreases due to misalignment, while allowing for efficient heat dissipation and compact size.
Implementation Method 1
a collimating lens to reduce the divergence angle of laser light that is emitted from the laser diode chip
Data Source
AI summary
A laser light source includes: an edge-emitting type laser diode chip that includes: a semiconductor multilayer structure including an emission layer, in which: the laser diode chip has a first end surface through which laser light generated in the emission layer is emitted, and a second end surface opposite to the first end surface, and a distance from the first end surface to the second end surface defines a cavity length; a submount having a principal surface on which the laser diode chip is fixed, and a back surface located opposite the principal surface; a pair of lens supports disposed on the principal surface of the submount and located at opposite sides with respect to the first end surface of the laser diode chip; a connecting portion connecting the pair of lens supports; a lens bonded to end surfaces of the pair of lens supports; and a semiconductor laser package.