Multi-wavelength Laser Diode Mounting on Prism Submount
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Solution Overview
Problem
Conventional multi-wavelength semiconductor laser devices face challenges in heat dissipation and optical design due to inefficient positioning of laser diodes and complex wiring, particularly when trying to treat data for CDs, DVDs, and Blu-ray discs in a single optical disc drive.
Innovation Solution
A multi-wavelength semiconductor laser device featuring a plate stem with a prism-shaped submount and lead pins arranged symmetrically to position laser diodes at the same distance from the center axis, facilitating efficient heat dissipation and simplified optical design, while reducing wiring complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser diodes are arranged on lateral sides of a prism-shaped submount, then emission points can be positioned at the same distance from the center axis (improving optical design), but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent transitions from planar arrangement of laser diodes to a three-dimensional configuration where diodes are mounted on lateral sides of a prism-shaped submount. This spatial reconfiguration allows emission points to be positioned at equal distances from the center axis while maintaining effective heat dissipation paths to the heat sink, resolving the contradiction between optical precision and thermal management.
2Manufacturing precision
If laser diodes are arranged inside a bent triangular prism submount, then emission points can be positioned at the same distance from the center, but wiring complexity increases
Solution Approach 1:
The patent divides the submount into distinct lateral side surfaces, each capable of independently mounting laser diodes. This segmentation allows for modular wiring arrangements where lead pins can be distributed across different faces of the prism, simplifying the wiring process compared to arranging all components inside a bent triangular prism structure.
3Adaptability or versatility
If infrared and red laser diodes are bonded on the blue-violet laser diode, then multi-wavelength functionality is achieved, but heat dissipation to the heat sink becomes inefficient
Solution Approach 1:
The patent arranges multiple laser diodes with different wavelengths (blue-violet, infrared, red) on separate lateral sides of a prism-shaped submount rather than bonding them on top of each other. This three-dimensional spatial arrangement provides direct heat dissipation paths from each laser diode to the heat sink, eliminating the thermal bottleneck created by stacked bonding configurations while maintaining multi-wavelength functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easier optical design, improved heat dissipation, and streamlined manufacturing by ensuring consistent emission point positioning and efficient wire bonding, addressing the limitations of prior art devices.
Implementation Method 1
lead pins penetrating the stem to be arranged in positions opposite to edge lines between lateral sides of the submount
Implementation Method 2
prism shaped submount whose bottom face is fixed to a face of the stem
Implementation Method 3
prism shaped submount whose bottom face is fixed to a face of the stem
Implementation Method 4
a plurality of laser diodes having emission wavelengths different from each other
Implementation Method 5
laser diodes having emission wavelengths different from each other, each being mounted on lateral sides of the submount
Data Source
AI summary
A multi-wavelength semiconductor laser device includes a plate stem; a prism shaped submount with a bottom face on a face of the stem; laser diodes having emission wavelengths different from each other are mounted on lateral sides of the submount so that their respective emission points are positioned at substantially the same distance from a center axis of the stem; and lead pins penetrating the stem are located along and opposite edge lines between adjacent pairs of the lateral sides of the submount.