Laser Diode Sealing Member Bonded to Submount and Lateral Wall
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Solution Overview
Problem
Existing light source devices face challenges in hermetically sealing the space that houses a laser diode, which can lead to issues such as dust collection and degradation of components due to non-hermetic sealing.
Innovation Solution
A light source device with a novel sealing structure that includes a substrate, a lateral wall part, one or more laser diodes, a submount, a sealing member, a heat dissipating block, and a heat conducting member, where the sealing member is bonded to both the submount and the lateral wall part to create a hermetic seal, and the heat conducting member facilitates thermal contact between the submount and the heat dissipating block, allowing efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing structure is implemented to hermetically seal the space housing the laser diode, then reliability is improved by preventing dust collection and component degradation, but device complexity increases due to additional sealing members and bonding structures
Solution Approach 1:
The patent combines the sealing function with the heat dissipation function by integrating the sealing member into the heat dissipation structure. The sealing member is bonded to both the submount and the heat dissipation block, creating a unified structure that simultaneously seals the laser diode space and conducts heat away from the laser diode, thereby improving reliability without proportionally increasing device complexity.
Solution Approach 2:
The sealing member serves multiple functions: it provides hermetic sealing to prevent dust ingress and component degradation, while also acting as a thermal conduction path for heat dissipation. This multi-functionality allows the structure to achieve reliable sealing without adding separate dedicated heat dissipation components, thus resolving the contradiction between reliability improvement and complexity increase.
2Temperature
If a heat dissipation block is added to improve heat dissipation performance, then temperature control is improved, but device complexity increases due to additional components and bonding structures
Solution Approach 1:
The patent merges the heat dissipation block with the sealing structure, where the sealing member simultaneously serves as a thermal conduction path. The heat dissipation block is bonded to the submount through the sealing member, creating an integrated structure that achieves effective heat dissipation without requiring separate, independently bonded heat dissipation components, thus improving temperature control while limiting complexity increase.
3Reliability
If multiple bonding interfaces are created for sealing and heat dissipation, then reliability is improved through better component attachment, but manufacturing precision requirements increase
Solution Approach 1:
The patent reduces the number of separate bonding interfaces by combining the sealing and heat dissipation functions into a single integrated structure. The sealing member is bonded to both the submount and the heat dissipation block in a unified bonding process, eliminating the need for separate bonding steps that would require multiple precision alignments, thereby improving reliability while reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable hermetic seal that prevents dust collection and component degradation, while also enhancing heat dissipation performance by efficiently conducting heat away from the laser diode.
Implementation Method 1
a heat conducting member located between the first submount and the heat dissipating block, in which the heat conducting member is in thermal contact with the first submount and the heat dissipating block
Data Source
AI summary
A light source device includes: a substrate having a support face; a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space; a laser diode located in the space; a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face; a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space; a heat dissipating block located above the first submount; and a heat conducting member located between the first submount and the heat dissipating block.